Wiring board
AssigneesShinko Electric Industries Co., Ltd., Asahi Kasei Microdevices Corporation
InventorsKei Murayama, Shinji Nakajima
Life of this patent
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Abstract
There is provided a wiring board. The wiring board includes: a semiconductor substrate having a through hole and covered with an insulating film; a through electrode formed in the through hole; a first wiring connected to one end of the through electrode; and a second wiring connected to the other end of the through electrode. The semiconductor substrate includes: a semiconductor element and a first guard ring formed to surround the through hole. The semiconductor element includes a first conductivity-type impurity diffusion layer having a different conductivity-type from that of the semiconductor substrate and is electrically connected to the first wiring and the second wiring.
Claims10
A wiring board comprising:
- a semiconductor substrate having a through hole and covered with an insulating film;
- a through electrode formed in the through hole;
- a first wiring connected to one end of the through electrode;
- and
- a second wiring connected to the other end of the through electrode,
- wherein the semiconductor substrate comprises:
- a semiconductor element including a first conductivity-type impurity diffusion layer having a different conductivity-type from that of the semiconductor substrate and electrically connected to the first wiring and the second wiring;
- a first guard ring formed to surround the through hole;
- and
- a second guard ring formed to surround the first conductivity-type impurity diffusion layer, the semiconductor element, the through electrode and the first guard ring,
- wherein the semiconductor element, the first guard ring, and the second guard ring are embedded in the semiconductor substrate, and
- wherein the second guard ring is formed along side surfaces of the semiconductor substrate on an upper surface side thereof.
A semiconductor device comprising:
- a wiring board;
- and
- an electronic component mounted on the wiring board,
- wherein the wiring board comprises:
- a semiconductor substrate having a through hole and covered with an insulating film;
- a through electrode formed in the through hole;
- a first wiring connected to one end of the through electrode;
- and
- a second wiring connected to the other end of the through electrode,
- wherein the semiconductor substrate comprises:
- a semiconductor element including a first conductivity-type impurity diffusion layer having a different conductivity-type from that of the semiconductor substrate and electrically connected to the first wiring and the second wiring;
- a first guard ring formed to surround the through hole;
- and
- a second guard ring shaped like a frame in a plan view and being formed to surround the first conductivity-type impurity diffusion layer, the semiconductor element, the through electrode and the first guard ring,
- wherein the semiconductor element, the first guard ring, and the second guard ring are embedded in the semiconductor substrate, and
- wherein the second guard ring is formed along side surfaces of the semiconductor substrate on an upper surface side thereof.
Dependencies are inferred from the claim text.