Light emitting device and method of manufacturing the same
AssigneeNichia Corporation
InventorTakuya Noichi
Life of this patent
Estimating the term…
Abstract
The light emitting device 100 includes a light emitting element 101, a package for arranging the light emitting element 101, and an electrically conductive wire 106 for connecting an electrode disposed on the package and an electrode of the light emitting element. The package includes a support member 108 having a mounting portion to arrange the light emitting element 101 and defining a recess 103 to house a semiconductor element 102 which is different than the light emitting element, and a light transmissive member 107 covering at least the light emitting element 101. The package defines a hollow portion 111 between the light transmissive member 107 covering the opening of the recess 103 and an inner wall defining the recess 103.
Claims11
A light emitting device comprising:
- a light emitting element having an electrode;
- a package disposing the light emitting element and having an electrode, the package further comprising:
- a support member having a mounting portion disposing the light emitting element and a recess housing a semiconductor element different than the light emitting element;
- and
- a light transmissive member disposed on the support member;
- and
- an electrically conductive member connecting the electrode disposed on the package and the electrode on the light emitting element,
- wherein the light transmissive member covers at least the light emitting element and an opening of the recess, and
- wherein the light transmissive member encloses the opening of the recess to define a hollow portion in the recess.
A method of manufacturing a light emitting device having a light emitting element, a package for arranging the light emitting element, and an electrically conductive member for connecting an electrode disposed on the package and an electrode of the light emitting element, the package including a support member having a mounting portion to arrange the light emitting element and defining a recess to house a semiconductor element which is different than the light emitting element, and a light transmissive member disposed on the support member, the light transmissive member at least covering the light emitting element and the opening of the recess, and a hollow portion being retained in the recess formed in the package, the method comprising:
- a first step of forming a support member defining a recess which opens to an upper surface of the support member where the light emitting element is to be mounted,
- a second step of housing the semiconductor element such that the upper surface of the semiconductor element is lower than the mounting portion of the light emitting element,
- a third step of arranging the light emitting element and the electrically conductive member, and
- a fourth step of disposing a light transmissive member on the support member so as to cover at least the light emitting element and the opening of the recess and to enclose the opening of the recess to define a hollow portion in the recess.
Dependencies are inferred from the claim text.