Multilayer wiring board and method of manufacturing the same
AssigneeShinko Electric Industries Co., Ltd.
InventorKoichi Tanaka
Life of this patent
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Abstract
A multilayer wiring board includes at least two wiring boards having wiring layers containing wiring patterns formed on both sides. A pair of fin-shaped bumps are formed at desired positions on wiring patterns on the surfaces facing each other, of the wiring boards, so that the bumps assume a slender shape as seen in plan view and that the bumps intersect each other. The pair of fin-shaped bumps are electrically connected to form an inter-board connection terminal. Further, an insulating layer is formed between the wiring boards, and protection films are formed to cover the entire surface except pad areas defined at predetermined positions on outer wiring layers of the wiring boards.
Claims4
A multilayer wiring board, comprising:
- at least two wiring boards stacked up;
- a pair of fin-shaped bumps formed at desired positions on wiring patterns on the surfaces facing each other, of the wiring boards, in such a manner that each bump assumes a slender shape in relation to a length of each bump as seen in plan view, and that the bumps intersect each other, the pair of fin-shaped bumps being electrically connected to form an inter-board connection terminal;
- and
- an insulating layer formed between the wiring boards, wherein
- each fin-shaped bump is connected along its entire length to the wiring pattern.
Dependencies are inferred from the claim text.