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US 8,026,335 B2Granted
Baked resin product and electronic device comprising the same
AssigneeSekisui Chemical Co., Ltd.
InventorsYoshinori Chiku, Yuji Eguchi, Kazuo Doyama
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AssigneeSekisui Chemical Co., Ltd.
InventorsYoshinori Chiku, Yuji Eguchi, Kazuo Doyama
Estimating the term…
The present invention provides a baked resin product that exhibits an excellent heat resistance and an electronic device that incorporates this baked resin product. The present invention provides a baked resin product obtained by baking a resin composition that contains a main chain-type aromatic benzoxazine structure, wherein the baked resin product has a peak measured by 13C-NMR at 58±2 ppm and a half width of this peak of 4 to 10 ppm. The present invention also provides a method of producing a baked resin product, comprising baking a resin composition that contains a main chain-type aromatic benzoxazine structure at 270° C. to 350° C. The present invention further provides an electronic device that incorporates this baked resin product.
A baked resin product obtained by baking a resin composition comprising a main chain-type aromatic benzoxazine structure, wherein the baking temperature for baking the resin composition is from 270 to 350° C., the baking time is one hour, and the baked resin product has a peak measured by 13C-NMR at 58±2 ppm and a half width of this peak of 4 to 10 ppm.
Dependencies are inferred from the claim text.