Method for manufacturing electronic circuit component

A method for manufacturing an electronic circuit component comprising the steps of:

• heating a layer containing at least one of a polyimide and a precursor thereof at a temperature of 200° C. or lower to form an insulating layer having a contact angle with water of 80° or more, and
• forming a coating film comprising a dispersion containing metal nanoparticles on the insulating layer and heating the coating film at a temperature of 200° C. or lower to form a conductive layer,
• wherein said polyimide and the precursor thereof include at least one of repeating units represented by formula (1) and formula (2):
• in which A in formula (1) and formula (2) is a tetravalent organic group represented by formula (3):
• wherein R1 to R4, which is the same or different, each represents a hydrogen atom, a fluorine atom or a monovalent organic group having 1 to 4 carbon atoms, and
• B represents a divalent organic group, and 10 to 100 mol % of B is a group represented by formula (4):
• wherein X1 to X3, which may be the same or different, each represents an —O— group, a —CO—O— group, a —CO—S— group, a —CO—NH— group, an alkylene group having 1 to 5 carbon atoms, which has a straight-chain or a branched structure, or an alkylenedioxo group having 1 to 5 carbon atoms, which is a straight-chain or a branched structure, or a single bond, R5 represents an alkyl group having 6 or more carbon atoms or a fluorine-containing alkyl group having 6 or more carbon atoms, and m and n, which is the same or different, each represents 0 or 1, and the remainder of B is a group free from an —X′—R5 group in formula (4).