Stacked integrated circuits package system with passive components
AssigneeSTATS ChipPAC, Ltd.
InventorsPhilip Lyndon Cablao, Dario S. Filoteo, Jr., Leo A. Merilo, Emmanuel Espiritu, Rachel Layda Abinan, Allan Ilagan
Life of this patent
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Abstract
A stacked integrated circuit package system is provided forming a first stack layer having a first integrated circuit die on a first substrate, forming a second stack layer having a second integrated circuit die on a second substrate, and mechanically and electrically connecting a spacer layer having a first passive component between the second stack layer and the first stack layer.
Claims20
A method of manufacture of a stacked integrated circuit package system comprising:
- forming a first stack layer having a first integrated circuit die on a first substrate;
- forming a second stack layer having a second integrated circuit die on a second substrate;
- and
- connecting a first passive component for providing a direct mechanical connection between the second substrate and the first integrated circuit die, wherein the first passive component is in a package having a predetermined thickness to separate the second stack layer and the first stack layer by the predetermined thickness.
A method of manufacture of a stacked integrated circuit package system comprising:
- forming a first stack layer having a first integrated circuit die on a first substrate;
- forming a second stack layer having a second integrated circuit die on a second substrate;
- connecting a first passive component for providing a direct mechanical connection between the second substrate and the first integrated circuit die, wherein the first passive component is in a package having a predetermined thickness to separate the second stack layer and the first stack layer by the predetermined thickness;
- electrically connecting the first integrated circuit die and the first substrate;
- and
- electrically connecting the second substrate and the first substrate.
A stacked integrated circuit package system comprising:
- a first stack layer having a first integrated circuit die on a first substrate;
- a second stack layer having a second integrated circuit die on a second substrate;
- and
- a first passive component for providing a direct mechanical connection between the second substrate and the first integrated circuit die, wherein the first passive component is in a package having a predetermined thickness for separating the second stack layer and the first stack layer by the predetermined thickness.
Dependencies are inferred from the claim text.