Integrated circuit package system with slotted die paddle and method of manufacture thereof

A method of manufacture of an integrated circuit package system comprising:

• providing a selective slot die paddle having selective slots and edge pieces around the perimeter including half etching a tie bar for supporting the selective slot die paddle;
• providing extended leads protruding into the selective slots including providing leads adjacent to the extended leads;
• mounting an integrated circuit die on the selective slot die paddle including aligning pads with the extended leads;
• and
• coupling bond wires between the integrated circuit die, the edge pieces, the extended leads, or a combination thereof including coupling the pads to the leads.

An integrated circuit package system comprising:

• a selective slot die paddle having selective slots and edge pieces around the perimeter includes a tie bar, half etched, for supporting the selective slot die paddle;
• extended leads protruding into the selective slots;
• an integrated circuit die mounted on the selective slot die paddle;
• and
• bond wires coupled between the integrated circuit die, the edge pieces, the extended leads, or a combination thereof.