Developing apparatus and developing method
AssigneeTokyo Electron Limited
InventorsAtsushi Ookouchi, Taro Yamamoto, Hirofumi Takeguchi, Hideharu Kyouda, Kousuke Yoshihara
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AssigneeTokyo Electron Limited
InventorsAtsushi Ookouchi, Taro Yamamoto, Hirofumi Takeguchi, Hideharu Kyouda, Kousuke Yoshihara
Estimating the term…
A developer nozzle is moved from a periphery of a wafer toward the central portion while an exposed substrate held at a spin chuck is being rotated about a vertical axis and while a developing solution is being discharged from the developer nozzle, and this way the developing solution is supplied to the surface of the wafer, the developer nozzle having a slit-like ejection port whose longitudinal direction is oriented to the direction perpendicular to the radial direction of the wafer. The movement speed of the nozzle is higher than a case where a nozzle with a small-diameter circular nozzle is used, and this enables a development time to be reduced. Further, the thickness of a developing solution on a substrate can be reduced, so that the developing solution can be saved.
A developing method comprising:
Dependencies are inferred from the claim text.