Method of manufacturing wiring circuit board
AssigneeNitto Denko Corporation
InventorsMasaki Mizutani, Hirofumi Fujii
Life of this patent
Estimating the term…
Abstract
A conductor circuit (2) having a predetermined pattern is formed on a base material (1); a photosensitive resin composition layer is formed on a surface of the base material, on which the conductor circuit (2) having the predetermined pattern is formed, by using a photosensitive resin composition; a surface of the photosensitive resin composition layer is irradiated with and exposed to active light rays through a photomask having a predetermined pattern; a solder resist layer (3a) having a predetermined pattern is formed by using a developing solution; and the formed solder resist layer (3a) is irradiated with ultraviolet light by using a low-pressure mercury-vapor lamp.
Claims2
A method of manufacturing a wiring circuit board, comprising:
- forming a predetermined conductor circuit pattern on a base material;
- forming a photosensitive resin composition layer on a surface of the base material on which the conductor circuit pattern is formed by using a photosensitive resin composition containing a cyclic phosphazene compound;
- irradiating a surface of the photosensitive resin composition layer with active light rays through a photomask having a predetermined pattern, thereby exposing the surface of the photosensitive resin composition layer to the active light rays;
- forming a solder resist layer having a predetermined pattern by using a developing solution after the exposure step;
- then
- irradiating the solder resist layer with ultraviolet light at a dose of 200 to 3000 mJ/cm2 by using a low-pressure mercury-vapor lamp thereby suppressing the separating of the cyclic phosphazene compound;
- and then
- subjecting the solder resist layer to irradiation with ultraviolet light by the use of a high-pressure mercury-vapor lamp.
Dependencies are inferred from the claim text.