Sensor-securing apparatus and camera module
AssigneeKabushiki Kaisha Toshiba
InventorTetsuo Saito
Life of this patent
Estimating the term…
Abstract
According to one embodiment, a sensor-securing apparatus has a frame having a sensor-mount region to hold an image sensor that generates heat while operating. The frame has a first adhesive-applying hole and a plurality of second adhesive-applying holes. The first adhesive-applying hole opens in the sensor-mount region and faces the center part of the image sensor. The second adhesive-applying holes are smaller than the first adhesive-applying hole, open in the sensor-mount region and are arranged around the first adhesive-applying hole. Adhesive is filled in the first adhesive-applying hole and the second adhesive-applying holes. The adhesive secures the image sensor to the frame.
Claims10
A sensor-securing apparatus comprising:
- a metal frame having a sensor-mount region;
- and
- an image sensor that is fixed to the sensor-mount region and generates heat in an operation, wherein the frame includes:
- a mount surface in which the sensor-mount region is defined;
- a projection protruding from the mount surface;
- a heat-receiving surface that is formed at the distal end of the projection and contacts with the image sensor;
- a first adhesive-applying hole opening in the heat-receiving surface and facing a center part of the image sensor;
- and
- a plurality of second adhesive-applying holes opening in the mount surface around the projection, the second adhesive-applying holes smaller than the first adhesive-applying hole and distant from the first adhesive-applying hole;
- and
- thermally conductive adhesive is filled in each of the first adhesive-applying hole and the second adhesive-applying holes, to secure the image sensor to the frame.
A sensor-securing apparatus comprising:
- an image sensor that generates heat;
- a substrate configured to support the image sensor, and having a through hole to be aligned with a center part of the image sensor;
- and
- a metal frame arranged in an opposite side of the image sensor with respect to the substrate, the metal frame having a mount surface to which the image sensor is fixed;
- wherein the frame includes:
- a projection protruding from the mount surface so as to enter inside the through hole of the substrate;
- a heat-receiving surface that is formed at the distal end of the projection and contacts with the center part of the image sensor;
- a first adhesive-applying hole opening in the heat-receiving surface;
- and
- a plurality of second adhesive-applying holes opening in the mount surface around the projection so as to surround the first adhesive-applying hole, the second adhesive-applying holes smaller than the first adhesive-applying hole and distant from the first adhesive-applying hole;
- and
- thermally conductive adhesive is filled in each of the first adhesive-applying hole and the second adhesive-applying holes, to secure the image sensor to the frame.
A camera module comprising:
- a front cover having a lens mount;
- a metal frame that is fixed to the front cover and has a sensor-mount region;
- and
- an image sensor that is fixed to the sensor-mount region and generates heat in an operation, wherein the frame includes
- a mount surface in which the sensor-mount region is defined;
- a projection protruding from the mount surface;
- a heat-receiving surface that is formed at the distal end of the projection and contacts with the image sensor;
- a first adhesive-applying hole opening in the heat-receiving surface and facing a center part of the image sensor;
- and
- a plurality of second adhesive-applying holes opening in the mount surface around the projection, the second adhesive-applying holes smaller than the first adhesive-applying hole and distant from the first adhesive-applying hole;
- and
- thermally conductive adhesive is filled in each of the first adhesive-applying hole and the second adhesive-applying holes, to secure the image sensor to the frame.
Dependencies are inferred from the claim text.