Method for producing a composite material, associated composite material and associated semiconductor circuit arrangements
AssigneeInfineon Technologies AG
InventorsOliver Hellmund, Daniel Kraft, Friedrich Kroener, Francisco Javier Santos Rodriguez, Carsten Von Koblinski
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Abstract
A method for producing a composite material, associated composite material and associated semiconductor circuit arrangements is disclosed. A plurality of first electrically conducting material particles are applied to a carrier substrate and a second electrically conducting material is galvanically deposited on a surface of the first material particles in such a way that the second material mechanically and electrically bonds the plurality of first material particles to one another.
Claims28
A method for producing a composite material, the method comprising:
- applying a plurality of first electrically conducting material particles to a carrier substrate;
- pressing the first material particles on the carrier substrate using a pressing plate after applying the material particles, wherein the pressing plate has openings, allowing a galvanic fluid used in the galvanic deposition to pass through but not allowing the first material particles to pass through;
- and
- galvanically depositing a second electrically conducting material on a surface of the first material particles for bonding the plurality of first material particles and for producing the composite material.
A method for manufacturing a composite material, the method comprising:
- applying a plurality of metal particles to a carrier substrate, wherein the carrier substrate comprises an insulating layer with depressions;
- and
- galvanically depositing an electrically conducting material on a surface of the metal particles, bonding together the plurality of metal particles forming the composite material, wherein galvanically depositing comprises forming a seed layer on a surface of the insulating layer.
A method of manufacturing a semiconductor device, the method comprising:
- forming a trench in a substrate;
- forming a seed layer on sidewalls of the trench;
- filling the trench with a plurality of first electrically conducting material particles;
- and
- galvanically filling a second electrically conducting material in the trench, wherein the second electrically conducting material and first electrically conducting material particles form a composite material.
A method for manufacturing a composite material, the method comprising:
- applying a plurality of metal particles to a carrier substrate;
- galvanically depositing an electrically conducting material on a surface of the metal particles, bonding together the plurality of metal particles forming the composite material;
- and
- pressing the plurality of metal particles on the carrier substrate using a pressing plate after applying the plurality of metal particles, wherein the pressing plate comprises openings, which allow a galvanic fluid used in the galvanic deposition to pass through but do not allow the plurality of metal particles to pass through.
Dependencies are inferred from the claim text.