Process for fabricating a monolayer or multilayer metal structure in LIGA technology, and structure obtained
AssigneeDoniar S.A.
InventorClément Saucy
Life of this patent
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Abstract
The invention relates to a process for fabricating a monolayer or multilayer metal structure in LIGA technology, in which a photoresist layer is deposited on a flat metal substrate, a photoresist mold is created by irradiation or electron or ion bombardment, a metal or alloy is electroplated in this mold, the electroformed metal structure is detached from the substrate and the photoresist is separated from this metal structure, wherein the metal substrate is used as an agent involved in the forming of at least one surface of the metal structure other than that formed by the plane surface of the substrate.
Claims21
A process for fabricating simultaneously a plurality of monolayer or multilayer metal structures in LIGA technology, comprising, in sequence:
- depositing a photoresist layer on a flat bulk metal substrate,
- creating a plurality of photoresist molds by irradiation or electron or ion bombardment,
- electroplating a metal or alloy in these molds to form electroformed metal structures,
- carrying out one or more machining operations on the upper face of the electroformed metal structures,
- detaching the electroformed metal structures and the photoresist layer from the substrate, and
- separating the photoresist from these metal structures,
- wherein the bulk metal substrate on which the photoresist layer is deposited is a passivated bulk metal substrate for separating the metal structures and the photoresist from the bulk metal substrate by delamination,
- wherein a positioning member is fastened to the substrate before forming said electroformed metal structures, wherein the positioning member positions an insert on said substrate, wherein said insert is removably associated with said positioning member,
- wherein said positioned insert becomes attached to said electroformed metal structures when said electroformed metal structures are formed, and
- wherein the electroformed metal structures are detached from the substrate together with said insert attached to the metal structures and the photoresist layer, so that the obtained metal structures have the positioned insert attached thereto.
A process for fabricating simultaneously a plurality of monolayer or multilayer metal structures in LIGA technology, comprising, in sequence:
- depositing a photoresist layer on a flat bulk metal substrate,
- creating a plurality of photoresist molds by irradiation or electron or ion bombardment,
- electroplating a metal or alloy in these molds to form electroformed metal structures,
- carrying out one or more machining operations on the upper face of the electroformed metal structures,
- detaching the electroformed metal structures and the photoresist layer from the substrate, and
- separating the photoresist from these metal structures,
- wherein the bulk metal substrate on which the photoresist layer is deposited is a passivated bulk metal substrate for separating the metal structures and the photoresist from the bulk metal substrate by delamination,
- wherein a screw is placed in at least one tapped hole made through the metal substrate before the electroformed metal structures are formed, so that a portion of the screw extends beyond the surface of the substrate,
- wherein the electroformed metal structures are formed directly surrounding the portion of the screw extending beyond the surface of the substrate, and
- wherein, before detaching the metal structures and the cured photoresist from the metal substrate, the screw is unscrewed, so that the metal structures have at least one threaded hole formed therein.
Dependencies are inferred from the claim text.