Gas injection system for plasma processing

A gas injector for supplying process gas to a plasma processing chamber wherein a semiconductor substrate is subjected to plasma processing, the gas injector comprising:

• a cylindrical gas injector body made of quartz, the gas injector body is sized to extend through a chamber wall of the processing chamber such that an axial distal end surface and side surface of the gas injector body is exposed within the processing chamber, the gas injector body including a plurality of gas outlets adapted to supply process gas into the processing chamber, wherein the gas outlets are located in the side surface of the gas injector body and the gas outlets inject process gas at an acute angle with respect to a central axis of the injector body;
• wherein the injector body has an outer diameter of about 1 inch and all of the gas outlets located in the side surface inject the process gas at the same acute angle;
• wherein the gas outlets in the side surface extend at an angle of 10 to 75° to the central axis of the cylindrical body;
• wherein the gas injector is adapted to be slidably fitted in a dielectric window of an inductively coupled plasma processing chamber with an O-ring between the gas injector and the window;
• wherein the gas injector further includes a gas outlet in a center of the axial distal end surface of the injector body;
• wherein all of the gas outlets in the side surface have inlets located the same distance from the central axis and inject the process gas at the same acute angle;
• and
• wherein the injector body includes a central bore extending through an upper axial end of the injector body.