System for measuring and controlling the level of vacuum applied to a conditioning holder within a CMP system
AssigneeTBW Industries Inc.
InventorStephen J. Benner
Life of this patent
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Abstract
A method and apparatus for conditioning polishing pads that utilizes an apertured conditioning disk for introducing operation-specific slurries, without the need for additional tooling, platens, and materials handling. The method and apparatus utilizes a vacuum capability to pull waste material out of the polishing pad and through the apertured conditioning disk to evacuate the apparatus through an outlet port. The apparatus also includes a force adjustment system for providing measurement and control of the force applied by the conditioning disk to the polishing pad.
Claims2
A system for measuring and controlling the level of vacuum applied to a conditioning holder within a CMP system, the system comprising
- a pressure transducer for measuring a current vacuum level within the conditioning holder;
- a process controller responsive to the measured vacuum level for comparing this measured level to a predetermined set point and providing as an output a correction control signal;
- a vacuum controller coupled to the output of the process controller for translating the correction control signal into an equivalent voltage signal;
- and
- a vacuum regulating valve coupled between an external vacuum source and the conditioning holder, the vacuum regulating valve responsive to the output from the vacuum controller to adjust the vacuum level within the conditioning holder.
Dependencies are inferred from the claim text.