Back grinding method for wafer
AssigneeDisco Corporation
InventorsKazuma Sekiya, Yusuke Kimura, Takashi Mori, Toshiharu Daii
Life of this patent
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Abstract
A back grinding method for a wafer includes covering a face-side surface of the wafer with a resin film, and cutting the surface of the resin film to form a flat surface parallel to the face-side surface of the wafer. The wafer is held with the surface of the resin film in contact with a suction surface of a chuck table in a grinding apparatus, and the exposed back-side surface of the wafer is ground. Unevenness in thickness of the resin film is suppressed, whereby the thickness of the wafer subjected to back grinding is made to be uniform.
Claims3
A method of grinding a back-side surface of a wafer having a face-side surface provided with devices, said method comprising:
- a resin film covering step of covering said face-side surface of said wafer with a resin film;
- a wafer holding step of holding said wafer, with said face-side surface exposed, by a holding means of a cutting apparatus of which the facing angle relative to a machining plane of a cutting member held by a rotating body can be controlled to be substantially parallel;
- a wafer angle controlling step of regulating the facing angle of said holding means relative to said cutting member so as to control said face-side surface of said wafer held by said holding means to be substantially parallel to said machining plane of said cutting member;
- a resin film cutting step of cutting a surface of said resin film to be flat by said cutting member being rotated;
- and
- a back-side grinding step of holding said wafer by a holding means of a grinding apparatus with the cut surface of said resin film being directed downward and grinding said exposed back-side surface of said wafer.
Dependencies are inferred from the claim text.