US 8,025,205 B2Granted

Electronic component mounting method

AssigneesPanasonic Corporation, Namics Corporation

InventorsTadahiko Sakai, Hideki Eifuku, Osamu Suzuki, Satomi Kawamoto

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Abstract

By an electronic component mounting method for electrically connecting bumps to board electrodes, in a contact process for placing a thermosetting resin in a liquid glob state on the board surface and bringing the lower surface of the electronic component into contact with the thermosetting resin, the bumps are pressurized against the electrodes in positional alignment in a liquid glob distribution state where one portion of the liquid glob is arranged inside an electronic component mounting region and a remaining portion greater in liquid measure than the one portion is arranged outside the electronic component mounting region. The thermosetting resin enters into a gap between the electronic component and the board by capillarity in a thermocompression bonding process. This prevents voids occurring in the sealing resin, reinforces bonded portions of bumps and electrodes with thermally cured thermosetting resin, thereby preventing bonded portion breakage due to thermal stress generated during cooling.

Claims6

Dependent claims

An electronic component mounting method for electrically connecting bumps formed on an electronic component to electrodes formed in an electronic component mounting region on a board by metal bonding, comprising:

placing a liquid thermosetting resin in a liquid glob state on a surface of the board so that one portion of the thermosetting resin is arranged inside the electronic component mounting region and a remaining portion of a liquid measure of the thermosetting resin greater than that of the one portion is arranged outside the electronic component mounting region;
after said placing of the liquid thermosetting resin, moving down a thermocompression bonding head which holds the electronic component to the board, and then bringing a bump formation surface of the electronic component into contact with the one portion of the thermosetting resin in the liquid glob state while pressurizing the bumps against the electrodes of the board;
carrying out metal bonding of the bumps and the electrodes by heating the electronic component by the thermocompression bonding head in a state in which the bumps are pressurized against the electrodes, while heating the thermosetting resin so that entry of the thermosetting resin in the liquid glob state into a gap between the board and the electronic component in the electronic component mounting region is promoted and thermosetting reaction of the thermosetting resin which has entered the gap is promoted, thereby bonding the electronic component to the board via cured thermosetting resin;
and then
moving the thermocompression bonding head away from the electronic component, thereby mounting the electronic component on the board.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application: 12/090,528Filed 18 Oct 2006
Priority: JP 2005-30612220 Oct 2005
Published: US 2009/0288767 A126 Nov 2009
Granted: 27 Sep 2011
Term ends: Not estimatedThe source records don’t support an estimate.

Classification13 codes

H10W 74/012
Manufacture or treatment: of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
H10W 72/30
Interconnections or connectors in packages: die-attach connectors
H10W 74/15
Characterised by their shape or disposition: on active surfaces of flip-chip devices, e.g. underfills
H10W 72/07141
Apparatus therefor: means for applying energy, e.g. ovens or lasers