Electronic part, method for fabricating electronic part, acceleration sensor, and method for fabricating acceleration sensor
AssigneeOki Semiconductor Co., Ltd.
InventorNobuo Ozawa
Life of this patent
Estimating the term…
Abstract
There is provided an electronic part that has a substrate, an insulating layer formed on the substrate and a pad formed on the insulating layer and is electrically connected with an external terminal and that further includes a cavity formed at least at either one of the substrate corresponding to a bottom surface of the electrode pad and a region of the insulating layer. It provides a highly reliable electronic part, its fabrication method as well as an acceleration sensor using the electronic part and its fabrication method.
Claims22
An electronic part, comprising:
- a substrate;
- an insulating layer formed on the substrate;
- and
- an electrode pad formed on the insulating layer and electrically connected with an external terminal,
- wherein a cavity is formed at at least one of a region of the substrate corresponding to a bottom surface of the electrode pad and a region of the insulating layer corresponding to the bottom surface of the electrode pad.
An improved acceleration sensor, having detector means for detecting acceleration, an electrode pad, a dead-weight section, and a substrate having a fixing section surrounding the dead-weight section, the dead-weight section being flexibly connected with the fixing section, wherein the improvement comprises:
- an insulating layer is formed on the fixing section;
- the electrode pad is disposed on the insulating layer and is electrically connected with the detecting means;
- and
- a cavity is formed at least one of a region of the substrate corresponding to a bottom surface of the electrode pad and a region of the insulating layer corresponding to the bottom surface of the electrode pad.
An electronic part, comprising:
- a substrate having top and bottom sides;
- an insulating layer on the top side of the substrate;
- and
- an electrode pad on the insulating layer,
- wherein a cavity is disposed between the bottom side of the substrate and the electrode pad, and
- wherein a line drawn substantially perpendicular to the bottom side of the substrate passes through the cavity and the electrode pad.
Dependencies are inferred from the claim text.