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US 8,024,936 B2Granted
Cooling apparatus, systems, and methods
AssigneeHalliburton Energy Services, Inc.
InventorsBruce H Storm, Dingding Chen, Haoshi Song
Life of this patent
Estimating the term…
Abstract
Apparatus and systems, as well as methods and articles, may operate to actively cool an electronic device using a first heat removing cooling element, and to induce a thermal gradient in a heat pipe by conducting heat from a hot side of the first heat removing cooling element to a cold side of a second heat removing cooling element using the heat pipe. The heat pipe may comprise a variable conductance heat pipe. The apparatus and system may operate in a downhole environment, including logging and drilling operations.
Claims14
An apparatus, comprising:
- a thermal component;
- a first heat removing cooling element configured to receive operating power, to thermally couple to the thermal component, and disposed to receive heat from the thermal component when the operating power is received;
- a heat pipe connected to and disposed directly adjacent to a hot side of the first heat removing cooling element and disposed to receive heat from the hot side of the first heat removing cooling element when the operating power is received;
- a second heat removing cooling element having a cold side connected to and disposed directly adjacent to a hot side of the heat pipe, the second heat removing cooling element configured to receive operating power to actively induce a thermal gradient in the heat pipe and disposed to receive heat from the hot side of the heat pipe;
- and
- a primary heat sink connected to and disposed directly adjacent to a hot side of the second heat removing cooling element and disposed to receive heat from the hot side of the second heat removing cooling element when the operating power is received.
3 more elements
A system, comprising:
- a thermal component;
- a first heat removing cooling element configured to receive operating power, to thermally couple to the thermal component, and disposed to receive heat from the thermal component when the operating power is received;
- a first heat pipe connected to and disposed directly adjacent to a hot side of the first heat removing cooling element and disposed to receive heat from the hot side of the first heat removing cooling element when the operating power is received;
- a second heat removing cooling element having a cold side connected to and disposed directly adjacent to a hot side of the first heat pipe, the second heat removing cooling element configured to receive operating power to actively induce a thermal gradient in the first heat pipe and disposed to receive heat from the hot side of the first heat pipe;
- and
- a pressure housing including a primary heat sink to connected to and disposed directly adjacent to a hot side of the second heat removing cooling element and disposed to receive heat from the hot side of the second heat removing cooling element when the operating power is received.
3 more elements
Dependencies are inferred from the claim text.