US 8,019,580 B1 · Transient thermal analysis

Abstract

Transient thermal simulation of semiconductor chips uses region-wise variable spatial grids and variable temporal intervals, enabling spatio-temporal thermal analysis of semiconductor chips. Temperature rates of change across a die and/or package of an integrated circuit are computed and tracked versus time. Critical time interval(s) for temperature evaluation are determined. Temperatures of elements, components, devices, and interconnects are updated based on a 3D full chip temperature analysis. Respective power dissipations are updated, as a function of the temperatures, with an automated interface to one or more circuit simulation tools. Subsequently new temperatures are determined as a function of the power dissipations. User definable control and observation parameters enable flexible and efficient transient thermal analysis. The parameters relate to power sources, monitoring, reporting, error tolerances, and output snapshots. Viewing of waveform plots and 3D spatial variations of temperature enable efficient communication of results of the thermal analysis with designers of integrated circuits.

Claims10

Dependent claims

A computer implemented method for transient thermal modeling of integrated circuits comprising:

computing first respective power dissipations of respective elements of an integrated circuit in accordance with a first discrete simulation time interval;
computing respective temperatures of the elements, based at least in part on the first respective power dissipations;
computing second respective power dissipations of the elements based at least in part on the respective temperatures and in accordance with a second discrete simulation time interval;
wherein the computing respective temperatures is in accordance with a third discrete simulation time interval;
wherein the acts of computing are in accordance with advancement of simulation time;
wherein the acts of computing are in accordance with a spatially-varying grid and a temporal grid;
wherein the first discrete simulation time interval is later, with respect to the advancement of simulation time, than the second discrete simulation time interval;
and
further comprising adjusting a duration of at least one of the discrete simulation time intervals based at least in part on an error computed by one of the acts of computing.

6 more elements

A system for transient thermal modeling of integrated circuits comprising:

a computer-readable medium having instructions stored therein;
a processor;
and
wherein execution of the instructions by the processor causes the processor to perform functions comprising
computing first respective power dissipations of respective elements of an integrated circuit in accordance with a first discrete simulation time interval,
computing respective temperatures of the elements, based at least in part on the first respective power dissipations,
computing second respective power dissipations of the elements based at least in part on the respective temperatures and in accordance with a second discrete simulation time interval,
wherein the computing respective temperatures is in accordance with a third discrete simulation time interval,
wherein the acts of computing are in accordance with advancement of simulation time,
wherein the acts of computing are in accordance with a spatially-varying grid and a temporal grid;
wherein the first discrete simulation time interval is later, with respect to the advancement of simulation time, than the second discrete simulation time interval, and
further comprising adjusting a duration of at least one of the discrete simulation time intervals based at least in part on an error computed by one of the acts of computing.

9 more elements

Dependencies are inferred from the claim text.

Transient thermal analysis

Life of this patent

Transient thermal analysis

Life of this patent

Abstract

Claims10