Heat conductive silicone grease compositions

A heat conductive silicone grease composition, consisting essentially of:

• (A) 100 parts by volume of an organopolysiloxane represented by formula (1):
• wherein,
• each R1 represents, independently, an unsubstituted or substituted monovalent hydrocarbon group,
• each R2 represents, independently, an alkyl group, alkoxyalkyl group, alkenyl group or acyl group,
• a represents an integer from 4 to 99, and
• b represents an integer from 1 to 3,
• with a kinematic viscosity at 25° C. of 10 to 10,000 mm2/s,
• (B) 0.1 to 50 parts by volume of an alkoxysilane represented by formula (2):
• R3cR4dSi(OR5)4-c-d (2)
• wherein,
• each R3 represents, independently, an alkyl group of 9 to 15 carbon atoms,
• each R4 represents, independently, an unsubstituted or substituted monovalent hydrocarbon group of 1 to 8 carbon atoms,
• each R5 represents, independently, an alkyl group of 1 to 6 carbon atoms,
• c represents an integer from 1 to 3, and
• d represents an integer from 0 to 2,
• provided that c+d represents an integer from 1 to 3,
• (C) 100 to 2,500 parts by volume of a heat conductive filler,
• (D) an organopolysiloxane represented by an average composition formula (3):
• R6eSiO(4-e)/2 (3)
• wherein,
• each R6 represents, independently, an unsubstituted or substituted monovalent hydrocarbon group of 1 to 18 carbon atoms, and
• e represents a number from 1.8 to 2.2,
• with a kinematic viscosity at 25° C. of 10 to 100,000 mm2/s, and
• (E) a volatile solvent capable of dissolving or dispersing said components (A) and (B), in a quantity not greater than 100 parts by volume per 100 parts by volume of said component (A),
• wherein said component (E) is capable of dissolving or dispersing said components (A), (B), and (D),
• wherein said component (D) is present in an amount of not more than 500 parts by volume per one hundred parts by volume of component (A).