Random personalization of chips during fabrication

A method for fabricating multiple integrated circuit chips, said method comprising:

• developing, by a computer, a first design for a particular electronic device such that, in any instance of said particular electronic device that will be formed according to said first design, there is a predetermined probability that said particular electronic device will have a specific variation,
• said predetermined probability being less than 100%, and
• said specific variation comprising one of a specific defect and a specific parameter;
• developing, by said computer, a second design for an integrated circuit chip that incorporates at least one instance of said particular electronic device according to said first design;
• fabricating said multiple integrated circuit chips according to said second design such that each chip comprises said at least one instance of said particular electronic device formed according to said first design;
• and
• during said fabricating, selectively adjusting at least one process so as to selectively change said predetermined probability to a different predetermined probability such that on any of said chips said at least one instance of said particular electronic device has said different predetermined probability of having said specific variation.

A method for fabricating multiple integrated circuit chips, said method comprising:

• developing a first design for a particular electronic device such that, in any instance of said particular electronic device that will be formed according to said first design, there is a predetermined probability that said particular electronic device will have a specific variation,
• said predetermined probability being less than 100%, and
• said specific variation comprising one of a specific defect and a specific parameter;
• developing a second design for an integrated circuit chip that incorporates at least one instance of said particular electronic device according to said first design;
• fabricating multiple integrated circuit chips according to said second design such that each chip comprises said at least one instance of said particular electronic device formed according to said first design;
• and
• during said fabricating, selectively adjusting at least one process so as to selectively change said predetermined probability to a different predetermined probability such that on any of said chips said at least one instance of said particular electronic device has said different predetermined probability of having said specific variation, said different predetermined probability being less than said predetermined probability.

A method for fabricating multiple integrated circuit chips, said method comprising:

• developing a first design for a particular electronic device such that, in any instance of said particular electronic device that will be formed according to said first design, there is a predetermined probability that said particular electronic device will have a specific defect, said predetermined probability being less than 100%;
• developing a second design for an integrated circuit chip that incorporates at least one instance of said particular electronic device according to said first design;
• fabricating multiple integrated circuit chips according to said second design such that each chip comprises said at least one instance of said particular electronic device formed according to said first design;
• and
• during said fabricating, selectively adjusting at least one process so as to selectively change said predetermined probability to a different predetermined probability such that on any of said chips said at least one instance of said particular electronic device has said different predetermined probability of having said specific variation.