Method for validation of thermal solution for an electronic component
AssigneeDell Products L.P.
InventorsPaul T. Artman, Shawn P. Hoss
Life of this patent
Estimating the term…
Abstract
In one embodiment a method includes operating a component coupled to the system at a first steady state average power consumption, measuring the temperature of the component to produce a first temperature measurement, operating the component at a second, higher power consumption for a first time period, and measuring the temperature of the component at the end of the first time period to produce a second temperature measurement. A transient thermal metric is calculated based at least in part on the first and second temperature measurements, and the transient thermal metric is used to infer the thermal coupling status of a heat dissipation appliance that is nominally thermally coupled to the component.
Claims22
A method of operating an information handling system (IHS), the method comprising:
- operating a component coupled to the system at a first steady state average power consumption;
- measuring the temperature of the component to produce a first temperature measurement;
- operating the component at a second, higher power consumption for at least a first time period;
- measuring the temperature of the component at the end of the first time period to produce a second temperature measurement;
- calculating a transient thermal metric based at least in part on the first and second temperature measurements;
- and
- using the transient thermal metric to infer a physical bond line phase change thermal interface material coupling status of a heat dissipation appliance that is thermally coupled to the component.
An information handling system (IHS) capable of electrical coupling with a component thermally coupled to a heat dissipation appliance, the IHS comprising:
- at least one processor, the component at least partially controllable by the processor when the component is electrically coupled to the system;
- and
- a routine, executable by the processor, to shift the component from a first power consumption condition to a second power consumption condition and observe at least one component temperature difference responsive to the shift, the routine operable to test a physical bond line phase change thermal interface material coupling of the component to the heat dissipation appliance.
Dependencies are inferred from the claim text.