Filament lamp and light-irradiation-type heat treatment device
AssigneeUshiodenki Kabushiki Kaisha
InventorsShinji Suzuki, Akinobu Nakashima, Kenji Tanino
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AssigneeUshiodenki Kabushiki Kaisha
InventorsShinji Suzuki, Akinobu Nakashima, Kenji Tanino
Estimating the term…
A filament lamp includes multiple filament assemblies having filaments connected to paired leads, arrayed in order within a light emitting tube and following a tube axis thereof. Each lead is electrically connected in a seal area. Each filament is powered independently. The light emitting tube includes insulating walls or inner tubes between the filaments and leads that have openings through which the leads pass, and located along the tube axis in proximity to the inner wall of the light emitting tube. Multiple lead accommodation spaces corresponding to the number of leads are provided in the light emitting tube by the insulating walls with each lead passing through an opening in the insulating wall and placed without short circuits in its lead accommodation space.
A filament lamp, comprising:
A light irradiation heat treatment device fitted with a light source in which is located a filament lamp, a workpiece to be treated being heated by irradiation of the workpiece to be treated with light from that light source, wherein the filament lamp, comprises:
A light irradiation heat treatment device fitted with a lamp unit in which are arrayed multiple filament lamps, a workpiece to be treated being heated by irradiation of the workpiece to be treated with light from that lamp unit, wherein each of the filament lamps comprises:
Dependencies are inferred from the claim text.
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About 3 years 8 months of term left · ends 7 Jul 2030 (estimated)
This invention concerns a filament lamp and light-irradiation-type heat treatment device, and particularly a filament lamp used for heat treatment of a workpiece and a light-irradiation-type heat treatment device equipped with such a filament lamp.
Heat treatment is used in a variety of processes in the manufacture of semiconductors, including film growth, oxidation, nitriding, film stabilization, silicidation, crystallization, and ion injection activation. In particular, rapid thermal processing (hereafter referred to as “RTP”) of a semiconductor wafer or other workpiece to be treated by quickly raising and lowering its temperature enables improved throughput and quality, and so its use is desirable.
Incandescent lamps, for example, are used as the light source in this sort of light-irradiation-type heat treatment device (hereafter referred to as “heat treatment device”).
FIG. 1 is a perspective view showing the constitution of the filament lamp in accordance with the invention;
FIGS. 2(a)-2(c) show cross sections of the filament lamp of FIG. 1 in accordance with the invention;
FIG. 3 is a perspective view showing filament assemblies with respect to an inner tube of the filament lamp of FIG. 1 in accordance with the invention;
The first embodiment of this invention is explained using FIGS. 1 through 6. FIG. 1 is a perspective view showing the constitution of the filament lamp 1 involved in the invention of this embodiment. As shown in FIG. 1, the filament lamp 1 has a linear or other tubular light emitting tube 3, made of quartz glass or another light-transparent material. Air-tight seal areas 5a, 5b are formed by fusing sealing insulators 6a, 6b on the light emitting tube 2 at both ends of the light emitting tube 2. A tubular insulating wall/inner tube 3, made of quartz glass or another light-transparent material and shorter in length in the direction of the tube axis of the light emitting tube 2, is located on the same axis as the light emitting tube 2 in proximity to the inner surface of the light emitting tube 2 within the light emitting tube 2, in which is sealed a halogen gas. For example, five filament assemblies 41 to 45 are located within this inner tube, and filaments 411 to 451 of the filament assemblies 41 to 45 are arranged in order extending along the tube axis.
FIGS. 2(a)-2(c) show cross sections of the filament lamp 1 of the invention of the first embodiment, cut across and along the tube axis, and FIG. 3 is a perspective view showing the filament assemblies 41 to 45 with respect to the inner tube 3 of the filament lamp 1. FIGS. 2(a) & 2(b) are cross sections of the filament lamp 1 cut in the radial direction. FIG. 2(c) shows a cross section of the filament lamp 1 cut along the direction of the tube axis at line A-A′ in FIG. 2(a), and a cross section of the filament lamp 1 cut along the direction of the tube axis at line B-B′ in FIG. 2(b), and a front view of the filament lamp 1 as seen from C in FIG. 2(b).
As shown in FIGS. 2 and 3, slots 311 to 315, the same in number as the filament assemblies 41 to 45, are formed in the outer surface of the inner tube 3, separated from each other in the circumferential direction and extending along the tube axis. So that the leads 412 to 415 connected to both ends of the filaments 411 to 451 can pass through, there are openings 321a, 321b, openings 322a, 322b, openings 323a, 323b, openings 324a, 324b, openings 325a, 325b, two for each filament, in the slots 311 to 315. In such an inner tube 3, slots 311 to 315 having openings 321a, 321b, openings 322a, 322b, openings 323a, 323b, openings 324a, 324b, openings 325a, 325b for the passage of leads 412 to 452 are formed by machining quartz glass molded in tubular shape.