Semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorsAtsushi Kaneko, Yasuo Okada
Life of this patent
Estimating the term…
Abstract
A semiconductor device including a plurality of semiconductor elements, a substrate on which the plurality of semiconductor elements are mounted, the substrate also having a plurality of terminals for connecting to external equipment, a fuse mounted on the outside of a mounting area of the plurality of semiconductor elements and mounted on a surface of the substrate near a power supply terminal among the plurality of terminals, and the power supply terminal and the plurality of semiconductor elements are connected via the fuse.
Claims23
A memory card comprising:
- a plurality of semiconductor elements;
- a substrate on which said plurality of semiconductor elements are mounted, said substrate also having a plurality of terminals for connecting to external equipment;
- and
- a fuse mounted on the outside of a mounting area of said plurality of semiconductor elements and mounted on a surface of said substrate near a power supply terminal among said plurality of terminals;
- said power supply terminal and said plurality of semiconductor elements are connected via said fuse,
- wherein a first power supply connector which is electrically connected with said power supply terminal among said plurality of terminals, a fuse terminal which is electrically connected with both end parts of said fuse, and a second power supply connector which is electrically connected with a power supply input terminal of said plurality of semiconductor elements, are formed on the back surface of said substrate, and
- a power supply line is formed on the back surface of said substrate so that said first power supply connector and said second power supply connector are connected via said fuse.
A memory card comprising:
- a plurality of semiconductor elements;
- a substrate on which said plurality of semiconductor elements are mounted, said substrate also having a plurality of terminals for connecting to external equipment and a protrusion formed on a part of the periphery of said substrate on which other elements are mounted;
- and
- a fuse mounted on said protrusion;
- a power supply terminal among said plurality of terminals and said plurality of semiconductor elements are connected via said fuse,
- wherein a first power supply connector which is electrically connected with said power supply terminal among said plurality of said terminals, a fuse terminal which is electrically connected with both end parts of said fuse, and a second power supply connector which is electrically connected with a power supply input terminal of said plurality of semiconductor elements, are formed on the back surface of said substrate, and
- a power supply line is formed on the back surface of said substrate so that said first power supply connector and said second power supply connector are connected via said fuse.
A memory card comprising:
- a plurality of semiconductor elements;
- a substrate on which said plurality of semiconductor elements are stacked in a mounting area, said substrate also having a plurality of terminals for connecting to external equipment;
- and
- a fuse mounted on the outside of said mounting area of said plurality of semiconductor elements and mounted on a surface of said substrate near a power supply terminal among said plurality of terminals;
- said power supply terminal and said plurality of semiconductor elements are connected via said fuse,
- wherein a first power supply connector which is electrically connected with said power supply terminal among said plurality of terminals, a fuse terminal which is electrically connected with both end parts of said fuse, and a secondpower supply connector which is electrically connected with a power supply input terminal of said plurality of semiconductor elements, are formed on the back surface of said substrate, and
- a power supply line is formed on the back surface of said substrate so that said first power supply connector and said second power supply connector are connected via said fuse.
Dependencies are inferred from the claim text.