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US 8,014,162 B2Granted
Flexible printed circuit board
AssigneeYamaichi Electronics Co., Ltd.
InventorHideki Kusamitsu
Life of this patent
Estimating the term…
Abstract
A flexible printed circuit board wherein the insulative substrate 34 having a plurality of conductive layers 36b covered with a protective layer 38 is encircled by a mesh-cloth member 32.
Claims6
A flexible printed circuit board comprising:
- an insulative substrate having a plurality of ground conductive layers and a signal-transmission conductive layer formed between said ground conductive layers;
- and
- a reticulate covering member formed of a dielectric having voids for covering said insulative substrate wherein said reticulate covering member is a tube formed to have a predetermined gap from said insulative substrate;
- and
- wherein said insulative substrate is disposed inside of said tube.
2 more elements
A flexible printed circuit board comprising:
- an insulative substrate having a plurality of ground conductive layers and a signal-transmission conductive layer formed between said ground conductive layers;
- and
- a reticulate covering member formed of a dielectric having voids for covering said insulative substrate, and having a conductive layer on the outer circumference thereof, said conductive covering layer being electrically connected to an end of said ground conductive layer,
- wherein said reticulate covering member is a tube formed to have a predetermined gap from said insulative substrate;
- and
- wherein said insulative substrate is disposed inside of said tube.
3 more elements
Dependencies are inferred from the claim text.