Circuit substrate for preventing warpage and package using the same
AssigneeSamsung Electronics Co., Ltd.
InventorDae-Ho Lee
Life of this patent
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Abstract
In one embodiment, a circuit substrate comprises a substrate; and a warpage preventing pattern disposed on the substrate. The warpage preventing pattern comprises a first pattern at a first corner of the substrate and a second pattern at a second corner of the substrate. The first corner and the second corner are disposed adjacent to each other. An overall orientation of the first pattern is different from an overall orientation of the second pattern with respect to the substrate. The warping of a semiconductor package can be significantly reduced by cutting off stress lines in the corners of the circuit substrate. Various configurations and orientations of the warpage preventing pattern are provided in order to effectively block stress concentration in the corners of the circuit substrate.
Claims35
A circuit substrate comprising:
- a substrate having a first edge adjacent to a second edge and the first edge also adjacent to a third edge, the first edge and second edge meeting at a first corner, thereby forming a first corner region and the first edge and third edge meeting at a second corner, thereby forming a second corner region;
- and
- a warpage preventing pattern disposed on the substrate, the warpage preventing pattern comprising a first pattern including a first plurality of members at the first corner region of the substrate and a second pattern including a second plurality of members at the second corner region of the substrate,
- wherein each member of the first plurality of members is part of the first pattern disposed on the substrate and extends diagonally from the first edge to the second edge,
- wherein each member of the second plurality of members is part of the second pattern disposed on the substrate and extends diagonally from the first edge to the third edge, and
- wherein the first pattern is disconnected from the second pattern.
A circuit substrate comprising:
- a substrate including a conductive pattern region and a warpage preventing region, the substrate having a first edge adjacent to a second edge and the first edge also adjacent to a third edge, the first edge and second edge meeting at a first corner, thereby by forming a first corner region and the first edge and third edge meeting at a second corner, thereby forming a second corner region;
- and
- a warpage preventing pattern disposed on the warpage preventing region, the warpage preventing pattern comprising a first pattern including a first group of members the first corner region of the substrate and a second pattern including a second group of members at the second corner region of the substrate,
- wherein each member of the first group of members part of the first pattern disposed on the substrate and extends diagonally between the first edge and the second edge,
- wherein each member of the second group of members is part of the second pattern disposed on the substrate and extends diagonally between the first edge and the third edge,
- wherein the first pattern and second patterns are disconnected from each other.
A semiconductor package comprising:
- a substrate having a first edge adjacent to a second edge and the first edge also adjacent to a third edge, the first edge and second edge meeting at a first corner, thereby forming a first corner region and the first edge and third edge meeting at a second corner, thereby forming a second corner region;
- a conductive pattern region defined in an interior region of the substrate;
- a warpage preventing region defined in the first and second corner regions of the substrate outside of the conductive pattern region;
- a conductive pattern disposed on the conductive pattern region;
- a plurality of bond fingers disposed on the conductive pattern region;
- a plurality of solder ball pads disposed on the conductive pattern region;
- a semiconductor chip disposed on the substrate, the semiconductor chip having a plurality of bond pads disposed thereon, at least one bond pad electrically connected to at least one bond finger;
- and
- a warpage preventing pattern disposed on the warpage preventing region, the warpage preventing pattern comprising:
- a first pattern including a first plurality of members at the first corner region of the substrate;
- and
- a second pattern including a second plurality of members at a second corner region of the substrate,
- wherein each member of the first plurality of members is part of the first pattern disposed on the substrate and extends diagonally between the first edge and the second edge,
- wherein each member of the second plurality of members is part of the second pattern disposed on the substrate and extends diagonally between the first edge and the third edge, and
- wherein the first pattern is disconnected from the second pattern.
Dependencies are inferred from the claim text.