Spectroscopy module

Abstract

In a spectroscopy module 1, a light passing hole 50 through which a light L1 advancing to a spectroscopic portion 4 passes is formed in a light detecting element 5. Therefore, it is possible to prevent the relative positional relationship between the light passing hole 50 and a light detecting portion 5a of the light detecting element 5 from deviating. Moreover, the light detecting element 5 is bonded to a front plane 2a of a substrate 2 with an optical resin adhesive 63. Thus, it is possible to reduce a stress generated onto the light detecting element 5 due to a thermal expansion difference between the light detecting element 5 and the substrate 2. Additionally, the light transmissive plate 16 covers a part of a light incident opening 50a. Thus, a light incident side surface 63a of the optical resin adhesive 63 becomes a substantially flat plane in the light passing hole 50. Therefore, it is possible to make the light L1 appropriately incident into the substrate 2.

Dependencies are inferred from the claim text.