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US 8,013,627 B2Granted
Semiconductor device and method of fabricating the same
AssigneeSamsung Electronics Co., Ltd.
InventorBong-Il Park
Life of this patent
Estimating the term…
Abstract
Provided is a semiconductor device and a method of fabricating the same. The semiconductor device may include at least one logic circuit and at least one spare circuit. The at least one spare circuit may be that is a substitute for the at least one logic circuit and may not be connected to a power voltage source and/or a ground voltage source.
Claims10
A semiconductor device comprising:
- at least one logic circuit;
- and
- at least one spare circuit configured to be a substitute for the at least one logic circuit and is not connected to a power voltage source and a ground voltage source, wherein the at least one spare circuit does not include a contact connecting the power voltage source and the ground voltage source to the at least one spare circuit.
A method of fabricating a semiconductor device, the method comprising:
- forming at least one logic circuit;
- and
- forming at least one spare circuit, such that the at least one spare circuit is a substitute for the at least one logic circuit and is not connected to a power voltage source and a ground voltage source, and the forming of the at least one spare circuit includes forming the at least one spare circuit without contacts connecting the power voltage source and the ground voltage source to the at least one spare circuit.
Dependencies are inferred from the claim text.