Electronic device test apparatus and method of mounting of performance board in electronic device test apparatus
AssigneeAdvantest Corporation
InventorsKatsuhiko Namiki, Shigeaki Naito
Life of this patent
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Abstract
An electronic device test apparatus comprising: a test apparatus body for testing IC devices formed on a wafer for electrical characteristics; a probe card for electrically connecting the IC devices and the test apparatus body; a prober for pushing the wafer against the probe card so as to electrically connect the IC devices and the probe card; an abutting mechanism extending toward the back surface of the probe card and abutting against the back surface of the probe card; and a lock mechanism fixing the extension of the abutting mechanism in the state with the abutting mechanism abutting against the back surface of the probe card.
Claims7
A test head for testing an electronic device under test for electrical characteristics, the test head to which a performance board electrically connected to the electronic device under test is electrically connected,
- the test head comprising:
- an abutting device configured to move an abutting member toward a back surface of the performance board so that the abutting member abuts against the back surface of the performance board;
- and
- a fixing device configured to fix and release the abutting member in a state where the abutting member abuts against the back surface of the performance board, wherein
- the test head further comprises a holding device configured to hold the performance board at a center part of the performance board and/or a periphery of the center part.
A method of mounting a performance board in an electronic device test apparatus comprising:
- a test head for testing an electronic device under test for electrical characteristics;
- a performance board electrically connected to the electronic device under test and the test head;
- and a pushing device configured to push the electronic device under test against the performance board so as to electrically connect the electronic device under test to the performance board,
- the method of mounting a performance board comprising:
- (a) electrically connecting the performance board and the test apparatus body through connectors;
- (b) moving an abutting member toward a back surface of the performance board so that the abutting member abuts against the back surface of the performance board;
- and
- (c) fixing the abutting member in a state where the abutting member abuts against the back surface of the performance board, wherein
- the method of mounting a performance board further comprises (d) holding the performance board at a center part of the performance board and/or a periphery of the center part.
Dependencies are inferred from the claim text.