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US 8,013,621 B2Granted
Inspection method and program for inspecting electrical characteristics of a semiconductor wafer
AssigneeTokyo Electron Limited
InventorsSatoshi Sano, Daiki Kurihara
Life of this patent
Estimating the term…
Abstract
Disclosed is an inspection method capable of performing an inspection of high reliability even for very fine and thin-film electrode pads of a target object, by using needle traces formed on the electrode pads and making the electrode pads repeatedly contact the probes at high accuracy. In the inspection method, under the control of a control unit 15 of an inspection apparatus 10, by using old needle traces formed on the respective pads P of the target object such as a semiconductor wafer W, contactable regions S for the probes 12A in preparation for a present inspection, so that each of the probes 12A contact each of the electrode pad P in the contactable region S and within an empty area with no needle trace.
Claims23
An inspection method for inspecting electrical characteristics of a target object by bringing electrode pads of the target object placed on a mounting table in electrical contact with probes of a probe card arranged above the mounting table, the method comprising:
- a process of correcting contact positions between the electrode pads and the probes in preparation for a present inspection, using needle traces of the probes that are formed on the electrode pads, respectively, in a previous inspection,
- wherein the process of correcting contact positions between the electrode pads and the probes in preparation for the present inspection comprising:
- a first step of obtaining a first image by photographing the electrode pads to detect the needle trace formed on each of the electrode pads;
- a second step of obtaining an amount of positional deviation between the center of each of the electrode pads and the center of gravity of each of the needle traces on the electrode pads by using the first image;
- a third step of correcting contact positions of the probes used for the present inspection with the electrode pads to the centers of the electrode pads, respectively, by using the positions of the needle traces and the amount of positional deviation thereof;
- a fourth step of bringing the probes that are used for the present inspection in contact with the electrode pads after the correction in the third step to form a new needle trace on each of the electrode pads;
- a fifth step of obtaining a second image by photographing the electrode pads on which the new needle traces are respectively formed;
- and
- a sixth step of obtaining a contactable region for each of the probes in each of the electrode pads, based on size of the electrode pads and center of gravity of the new needle trace formed on each of the electrode pads.
6 more elements
An inspection method for inspecting electrical characteristics of a target object by bringing electrode pads of the target object placed on a mounting table in electrical contact with probes of a probe card arranged above the mounting table, the method comprising:
- a process of correcting contact positions between the electrode pads and the probes in preparation for a present inspection, using needle traces of the probes that are formed on the electrode pads, respectively, in a previous inspection,
- wherein the process of correcting contact positions between the electrode pads and the probes in preparation for the present inspection comprising:
- a first step of obtaining a first image by photographing the electrode pads to detect the needle trace formed on each of the electrode pads;
- a second step of obtaining an amount of positional deviation between the center of each of the electrode pads and the center of gravity of each of the needle traces on the electrode pads by using the first image;
- a third step of correcting contact positions of the probes used for the present inspection with the electrode pads to the centers of the electrode pads, respectively, by using the positions of the needle traces and the amount of positional deviation thereof;
- a fourth step of bringing the probes that are used for the present inspection in contact with the electrode pads after the correction in the third step to form a new needle trace on each of the electrode pads;
- a fifth step of obtaining a second image by photographing the electrode pads on which the new needle traces are respectively formed;
- a sixth step of comparing the first image with the second image to extract an image of the new needle trace of each of the electrode pads, obtaining expected contact positions for the probes to make contact during a next inspection by using an amount of positional deviation between the center of each of the electrode pads and the center of gravity of each of the new needle traces on the electrode pads, comparing the expected contact positions with respective empty areas with no needle trace of the corresponding second image, and, if the expected contact positions are included in the respective empty areas, arranging the expected contact positions in the respective empty areas to obtain the centers of gravity thereof;
- and
- a seventh step of correcting the contact position of each of the probes to the center of gravity of each of the expected contact positions arranged in the respective empty areas.
7 more elements
An inspection method for inspecting electrical characteristics of a target object by bringing electrode pads of the target object placed on a mounting table in electrical contact with probes of a probe card arranged above the mounting table, the method comprising:
- a process of correcting contact positions between the electrode pads and the probes in preparation for a present inspection, using needle traces of the probes that are formed on the electrode pads, respectively, in a previous inspection,
- wherein the process of correcting contact positions between the electrode pads and the probes in preparation for the present inspection comprising:
- a first step of obtaining a first image by photographing the electrode pads to detect the needle trace formed on each of the electrode pads;
- a second step of obtaining an amount of positional deviation between the center of each of the electrode pads and the center of gravity of each of the needle traces on the electrode pads by using the first image;
- a third step of correcting contact positions of the probes used for the present inspection with the electrode pads to the centers of the electrode pads, respectively, by using the positions of the needle traces and the amount of positional deviation thereof;
- a fourth step of bringing the probes that are used for the present inspection in contact with the electrode pads after the correction in the third step to form a new needle trace on each of the electrode pads;
- a fifth step of obtaining a second image by photographing the electrode pads on which the new needle traces are respectively formed;
- a sixth step of obtaining a contactable region for each of the probes in each of the electrode pads, based on size of the electrode pads and center of gravity of the new needle trace formed on each of the electrode pads;
- a seventh step of judging whether or not the contactable regions are included in the respective electrode pads;
- an eighth step of extracting an image of the new needle trace of each of the electrode pads based on the first image and the second image if the contactable regions are included in the respective electrode pads;
- and
- a ninth step of obtaining expected contact positions for the probes to make contact during a next inspection by using an amount of positional deviation between the center of each of the electrode pads and the center of gravity of each of the new needle traces on the electrode pads, comparing the expected contact positions with respective empty areas with no needle trace in the contactable regions, and, if the expected contact positions are included in the respective empty areas, arranging the expected contact positions in the respective empty areas to obtain the centers of gravity thereof as contact positions for the respective probes.
9 more elements
An inspection method for inspecting electrical characteristics of a target object by bringing electrode pads of the target object placed on a mounting table in electrical contact with probes of a probe card arranged above the mounting table, the method comprising:
- a process of correcting contact positions between the electrode pads and the probes in preparation for a present inspection, using needle traces of the probes that are formed on the electrode pads, respectively, in a previous inspection,
- wherein the process of correcting contact positions between the electrode pads and the probes in preparation for the present inspection comprising:
- a first step of obtaining a first image by photographing the electrode pads to detect the needle trace formed on each of the electrode pads;
- a second step of obtaining an amount of positional deviation between the center of each of the electrode pads and the center of gravity of each of the needle traces on the electrode pads by using the first image;
- a third step of correcting contact positions of the probes used for the present inspection with the electrode pads to the centers of the electrode pads, respectively, by using the positions of the needle traces and the amount of positional deviation thereof;
- a fourth step of bringing the probes that are used for the present inspection in contact with the electrode pads after the correction in the third step to form a new needle trace on each of the electrode pads;
- a fifth step of obtaining a second image by photographing the electrode pads on which the new needle traces are respectively formed;
- and
- a sixth step of comparing the first image with the second image to extract an image of the new needle trace of each of the electrode pads, obtaining expected contact positions for the probes to make contact during a next inspection, by following similar procedures to the first to third steps based on the center of gravity of each of the extracted images and the center of each of the electrode pads.
6 more elements
Dependencies are inferred from the claim text.