Cooling apparatus
AssigneeHon Hai Precision Industry Co., Ltd.
InventorsChih-Hao Yang, Che-Cheng Hu
Life of this patent
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Abstract
A cooling apparatus is for dissipating heat from an electronic device. The cooling apparatus includes a casing, an impeller, and a motor. The casing is for absorbing the heat and allowing coolant to flow therein. The impeller is received in the casing. The motor is received in the casing, and is for providing a force to drive the impeller to rotate to force the coolant to flow. The coolant flows between the casing and the motor to take the heat away.
Claims18
A cooling apparatus for dissipating heat from an electronic device, comprising:
- a casing for absorbing the heat and allowing coolant to flow therein, the casing having a speedup member therein;
- an impeller received in the casing;
- and
- a motor received in the casing, for providing a force to drive the impeller to rotate to force the coolant to flow;
- wherein the coolant flows between the casing and the motor to take the heat away;
- wherein the thickness of the speedup member gradually decreases along the rotation direction of the impeller, the speedup member is capable of accelerating the speed of the coolant flowing out of the casing.
A cooling apparatus for dissipating heat from an electronic device, the cooling apparatus comprising:
- a casing for absorbing the heat and allowing a coolant to flow therein, the case having a speedup member therein, an intake by which the coolant is admitted into the casing, and an outlet through which the coolant flows out of the casing;
- a drive coil received in the casing, for generating a magnetic force;
- a sealed device received in the casing, for sealing the drive coil from the coolant;
- and
- a rotatable module received in the casing, for being rotated by the magnetic force with respect to the sealed device to agitate the coolant;
- wherein the coolant flows between the casing and the sealed device to take the heat away;
- wherein the speedup member extends surrounding an inner side surface of the casing, and the thickness of the speedup member gradually decreases from one end defining the outlet to the other end, thus the outlet faces the flow direction of the coolant to accelerate the speed of the coolant flowing out of the casing from the outlet.
A cooling apparatus for dissipating heat from an electronic device, comprising:
- a casing for absorbing the heat and allowing coolant to flow therein, the casing having a speedup member therein;
- an impeller received in the casing which being driven to rotate to force the coolant to flow;
- wherein the thickness of the speedup member gradually decreases along the rotation direction of the impeller,
- wherein the casing comprises an intake by which the coolant is admitted into the casing, and an outlet through which the coolant flows out of the casing, the outlet is defined in the thicker end of the speedup member;
- wherein the casing further comprises a top board, and a hollow sidewall surrounding the top board and perpendicularly connecting with the top board, the speedup member is mounted at the joint between the top board and the sidewall, the speedup member extends surrounding an inner side surface of the sidewall, and the thickness thereof gradually decreases from one end defining the outlet to the other end, thus the thickness of the other end is zero.
Dependencies are inferred from the claim text.