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US 8,013,455 B2Granted
Semiconductor device having pads
AssigneeSamsung Electronics Co., Ltd.
InventorsJeong-Hoon Ahn, Heon-Jong Shin, Sung-Hoon Lee
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Abstract
A semiconductor device having pads is provided. The semiconductor device includes first pads formed along a first row, and second pads formed along a second row. The first via contact portions extending from the first pads toward the second row, and second via contact portions extending from the second pads toward the first row. The first and second via contact portions are arranged along a third row between the first and second rows.
Claims18
A semiconductor device, comprising:
- an interlayer dielectric layer formed on a surface of a substrate;
- a plurality of first pads arranged on the interlayer dielectric layer along a first row;
- a plurality of second pads arranged on the interlayer dielectric layer along a second row;
- a plurality of first via contact portions extending from the first pads toward the second row;
- a plurality of second via contact portions extending from the second pads toward the first row;
- at least one first via plug arranged in the interlayer dielectric layer below each of the first via contact portions such that the at least one first via plug contacts one of the first via contact portions;
- and
- at least one second via plug arranged in the interlayer dielectric layer below each of the second via contact portions such that the at least one second via plug contacts one of the second via contact portions,
- wherein the first via contact portions and the second via contact portions are arranged along a third row between the first row and the second row,
- the first pads and the second pads include a power pad supplying a power supply voltage, and a signal pad receiving and outputting an electrical signal,
- one of the first or second via contact portions is connected to the signal pad and each of the via contact portions connected to the signal pad has a width smaller than a width of the signal pad,
- the other of the first or second via contact portions is connected to the power pad and each of the via contact portions connected to the power pad has a width wider than the width of each via contact portion connected to the signal pad, and
- the widths of the signal pad, the via contact portions connected to the signal pad and the via contact portions connected to the power pad are parallel to the first, second and third rows.
10 more elements
A semiconductor device, comprising:
- a plurality of first pads arranged on a substrate along a first row;
- a plurality of second pads arranged on the substrate along a second row;
- a plurality of first via contact portions extending from the first pads toward the second row;
- and
- a plurality of second via contact portions extending from the second pads toward the first row,
- wherein the first via contact portions and the second via contact portions are arranged along a third row between the first and second rows, and an interval between adjacent first pads is equal to or smaller than an interval between adjacent via contact portions of the first and second via contact portions,
- the first pads and the second pads include a power pad supplying a power supply voltage, and a signal pad receiving and outputting an electrical signal,
- one of the first or second via contact portions is connected to the signal pad and each of the via contact portions connected to the signal pad has a width smaller than a width of the signal pad,
- the other of the first or second via contact portions is connected to the power pad and each of the via contact portions connected to the power pad has a width wider than each via contact portion connected to the signal pad, and
- the widths of the via contact portions connected to the signal pad, the via contact portions connected to the power pad and the signal pad are parallel to the first, second and third rows.
7 more elements
Dependencies are inferred from the claim text.