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US 8,013,454 B2Granted
Wiring substrate and display device including the same
AssigneeSharp Kabushiki Kaisha
InventorsKenichi Yamashita, Tetsuya Aita
Life of this patent
Estimating the term…
Abstract
An active matrix substrate includes a first substrate, a driving integrated circuit chip mounted on the first substrate with an anisotropic electrically conductive layer, and an insulating member. The insulating member isolates a terminal from a wiring and a bump electrode that are adjacent to the terminal portion and isolates a bump electrode facing the terminal portion from a bump electrode and a wiring that are adjacent to the bump electrode.
Claims23
A wiring substrate, comprising:
- a substrate including a plurality of wirings extending substantially in parallel with each other and each including a terminal portion;
- an integrated circuit chip including a plurality of bump electrodes arranged to correspond to respective terminal portions so as to face the respective terminal portions;
- an anisotropic electrically conductive layer located between the substrate and the integrated circuit chip and made of an insulating resin including electrically conductive fine particles dispersed therein to electrically connect the terminal portions to the plurality of bump electrodes;
- and
- at least one insulating member arranged to isolate a first one of the plurality of bump electrodes and a facing first terminal portion from a second one of the plurality of bump electrodes and a facing second terminal portion that are adjacent to the first one of the plurality of bump electrodes and the facing first terminal portion;
- wherein
- adjacent ones of the terminal portions are offset relative to each other;
- and
- a portion of the at least one insulating member is arranged to overlap and cover an upper portion of only alternating ones of the plurality of wirings such that similarly positioned upper portions of directly adjacent ones of the plurality of wirings are not both overlapped and covered by the at least one insulating member.
6 more elements
A display device, comprising:
- a wiring substrate including a substrate with a plurality of wirings extending substantially in parallel with each other and each having a terminal portion, an integrated circuit chip including a plurality of bump electrodes arranged to correspond to the respective terminal portions so as to face the respective terminal portions, an anisotropic electrically conductive layer located between the substrate and the integrated circuit chip and made of an insulating resin including electrically conductive fine particles dispersed therein to electrically connect the terminal portions to the plurality of bump electrodes, and at least one insulating member arranged to isolate a first one of the plurality of bump electrodes and a facing first terminal portion from a second one of the plurality of bump electrodes and a facing second terminal portion that are adjacent to the first one of the plurality of bump electrodes and the facing first terminal portion;
- a first electrode located on the wiring substrate;
- a display medium layer located on the first electrode;
- and
- a second electrode located on the display medium layer;
- wherein
- adjacent ones of the terminal portions are offset relative to each other;
- and
- a portion of the at least one insulating member is arranged to overlap and cover an upper portion of only alternating ones of the plurality of wirings such that similarly positioned upper portions of directly adjacent ones of the plurality of wirings are not both overlapped and covered by the at least one insulating member.
6 more elements
A display device, comprising:
- a first wiring substrate including a substrate with a plurality of first wirings extending substantially in parallel with each other and each including a terminal portion, an integrated circuit chip including a plurality of bump electrodes arranged to correspond to the respective terminal portions so as to face the respective terminal portions, an anisotropic electrically conductive layer located between the substrate and the integrated circuit chip and made of an insulating resin including electrically conductive fine particles dispersed therein to electrically connect the terminal portions to the plurality of bump electrodes, and at least one insulating member arranged to isolate a first one of the plurality of bump electrodes an a facing first terminal portion from a second one of the plurality of bump electrodes and a facing second terminal portion that are adjacent to the first one of the plurality of bump electrodes and the facing first terminal portion;
- a second wiring substrate including the first wiring substrate mounted thereon, the second wiring substrate including a plurality of second wirings respectively electrically connected to the plurality of first wirings and a first electrode electrically connected to the plurality of second wirings, respectively;
- a display medium layer located on the first electrode;
- and
- a second electrode located on the display medium layer;
- wherein
- adjacent ones of the terminal portions are offset relative to each other;
- and
- a portion of the at least one insulating member is arranged to overlap and cover an upper portion of only alternating ones of the plurality of first wirings such that similarly positioned upper portions of directly adjacent ones of the plurality of wirings are not both overlapped and covered by the at least one insulating member.
6 more elements
Dependencies are inferred from the claim text.