US 8,013,453 B2 · Leadless alignment of a semiconductor chip

Abstract

There is disclosed a mounting technique for mounting a semiconductor chip of the leadless or so-called flip chip type to a header. The header has an insert made of glass or other suitable non-conductive material within the header hollow. Mounted into the glass insert are a series of conductive metal pins which are placed in areas so that when a chip is mounted in the header, the chip makes contact with these conductive pins and allows one to make outside connections. Also positioned in the header are a series of nonconductive guide pins. These pins are placed in suitable positions in the header to enable one to contact the outside surfaces of the chip when the chip is placed in the header. In this manner, the chip is constrained from movement from side to side or from rotation. However, due to the positioning of the nonconductive pins within the header, it is possible to move the chip up and down while mounting.

Claims19

Dependent claims

A method of mounting a leadless or flip chip of a given geometrical configuration to a header, said header having a chip accommodating insulative surface surrounded by said shell and having a series of conductive pins extending from said insulative surface and positioned to contact terminals of said chips when said chip is placed in said header to enable connections to be made to said chip, comprising the steps of:

a) placing at least one non-conductive pin on said insulative surface and within said header shell and positioning said at least one non-conductive pin at a place wherein when said semiconductor chip is placed in said header and said non-conductive pin acts as a guide to enable said chip to be placed in said header while said pin prevents movement of said chip as rotational or side to side movement without penetrating the chip;
and
b) placing a first layer of glass in said shell and directing all pins both conductive and nonconductive through said first layer and sealing said glass layer to the inner wall of said header.

Dependencies are inferred from the claim text.

Leadless alignment of a semiconductor chip

Life of this patent

Leadless alignment of a semiconductor chip

Life of this patent

Abstract

Claims19