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US 8,013,439 B2Granted
Injection molded metal stiffener for packaging applications
AssigneeIntel Corporation
InventorSabina J. Houle
Life of this patent
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Abstract
In some embodiments, an injection molded metal stiffener for packaging applications is presented. In this regard, an apparatus is introduced comprising a microelectronic device package substrate, a microelectronic device coupled with a top surface of the package substrate, and an injection-molded, metal stiffener coupled with the package substrate, wherein the stiffener includes a central opening and at least partially surrounds the microelectronic device. Other embodiments are also disclosed and claimed.
Claims14
An apparatus comprising:
- one and only one microelectronic device package substrate, wherein the package substrate comprises a multi-layer organic substrate;
- a microelectronic device coupled with a top surface of the package substrate;
- and
- an injection-molded, metal stiffener coupled with the package substrate, wherein the stiffener includes a central opening and only partially surrounds the microelectronic device, wherein the stiffener further comprises a rib that extends vertically up from the stiffener.
1 more element
An electronic appliance comprising:
- a network controller;
- a system memory;
- and
- a processor, wherein said processor comprises:
- one and only one microelectronic device package substrate;
- a microelectronic device coupled with a top surface of the package substrate;
- and
- an injection-molded, metal stiffener coupled with the package substrate, wherein the stiffener includes a central opening and only partially surrounds the microelectronic device, wherein the stiffener further comprises an overhang that extends along a side of the package substrate.
5 more elements
An apparatus comprising:
- one and only one microelectronic device package substrate, wherein the package substrate comprises a bump-less build up layer substrate;
- a microelectronic device coupled with a top surface of the package substrate;
- and
- an injection-molded, metal stiffener coupled with the package substrate, wherein the stiffener includes a central opening and only partially surrounds the microelectronic device, wherein the stiffener further comprises an overhang that extends along a side of the package substrate.
1 more element
Dependencies are inferred from the claim text.