Virtual wire assembly having hermetic feedthroughs
AssigneeCochlear Limited
InventorsJames Dalton, Peter Single, David Money
Life of this patent
Estimating the term…
Abstract
A virtual wire assembly that includes a substantially electrically-nonconductive substrate and a plurality of hermetic feedthroughs including a conductive region extending transversely through the substrate to form a conductive pathway with accessible surfaces at opposing ends thereof, wherein each conductive pathway is electrically isolated from other conductive pathways. In certain embodiments of this aspect of the invention, the substantially electrically-nonconductive substrate is a semiconductor device, and the conductive regions each include an n-type or a p-type doped semiconductor material.
Claims30
An assembly comprising:
- a substantially electrically-nonconductive substrate having a plurality of hermetic feedthroughs comprising a first conductive region extending transversely through said substrate to form conductive surfaces on opposing sides of said substrate, wherein the respective first conductive regions are electrically isolated from one another, and wherein said substrate comprises a semiconductor device.
An assembly comprising:
- a casing;
- and
- a substantially electrically-nonconductive first substrate integrated into the casing, wherein
- a combination of the first substrate and the casing is configured to be a hermetic enclosure,
- a plurality of conductive regions are formed within the first substrate, the first conductive regions extending from a first side of the first substrate to a second side of the first substrate and having conductive surfaces exposed at both sides of the first substrate, and
- each conductive region is electrically isolated from the other first conductive regions.
Dependencies are inferred from the claim text.