Package substrate, semiconductor package having the package substrate

A semiconductor package comprising:

• a package substrate including an insulating substrate comprising a mount region and a clamp region, a circuit pattern formed on the insulating substrate, and a blocking member disposed on at least one side of the package substrate in the clamp region;
• a semiconductor chip having pads placed on the package substrate;
• conductive connecting members for electrically connecting the circuit pattern to the pads of the semiconductor chip;
• a molding member disposed on the semiconductor chip and the package substrate and covering the conductive connecting members;
• and
• external terminals mounted on the circuit pattern in the mount region,
• wherein the blocking member blocks a material used to form the molding member from moving from the clamp region to the mount region when the package substrate loaded in a mold die is pressurized to form the molding member, wherein the blocking member receives the molding material therein.