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US 8,013,429 B2Granted
Air cavity package with copper heat sink and ceramic window frame
AssigneeInfineon Technologies AG
InventorsAnwar A. Mohammed, Soon Ing Chew, Alexander Komposch, Christian Andrada
Life of this patent
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Abstract
An air cavity package is manufactured by attaching a die to a surface of a copper heat sink, dispensing a bead of epoxy around a periphery of the heat sink surface after the die is attached to the copper heat sink so that the bead of epoxy generally surrounds the die and placing a ceramic window frame on the bead of epoxy. The epoxy is cured to attach a bottom surface of the ceramic window frame to the copper heat sink.
Claims15
An air cavity package, comprising:
- a copper heat sink having a thermal conductivity of at least 350 W/mK;
- a die attached to a surface of the copper heat sink;
- a ceramic window frame having a bottom surface attached to a periphery of the heat sink surface via a cured epoxy, the ceramic window frame generally surrounding the die;
- and
- a fillet formed from a portion of the cured epoxy disposed along an outer sidewall of the ceramic window frame facing away from the die, the fillet extending over at least 25% of the height of the outer sidewall of the ceramic window frame as measured from the heat sink surface.
2 more elements
A package, comprising:
- a heat sink made of a copper alloy having a thermal conductivity of at least 350 W/mK;
- a die attached to a surface of the heat sink;
- a ceramic window frame having a bottom surface attached to a periphery of the heat sink surface via a cured epoxy, the ceramic window frame generally surrounding the die;
- and
- a fillet formed from a portion of the cured epoxy disposed along an outer sidewall of the ceramic window frame facing away from the die, the fillet extending over at least 25% of the height of the outer sidewall of the ceramic window frame as measured from the heat sink surface.
2 more elements
Dependencies are inferred from the claim text.