Imaging device, method for manufacturing the imaging device and cellular phone

An imaging device comprising:

• a lens;
• an optical filter;
• a semiconductor imaging element having a light receiving section;
• and
• a substrate including a partition wall on which said semiconductor imaging element and said optical filter are mounted, wherein
• the thermal expansion coefficient of said substrate is greater than the thermal expansion coefficient of said optical filter, and the thermal expansion coefficient of said optical filter is greater than the thermal expansion coefficient of said semiconductor imaging element,
• said partition wall has an opening corresponding to said light receiving section of said semiconductor imaging element,
• said semiconductor imaging element and said optical filter are located on one side of said partition wall, while said lens is located on the other side of said partition wall,
• each peripheral portion of said semiconductor imaging element and said optical filter opposed to said lens is fixed to said substrate with an adhesive, and
• said semiconductor imaging element and said optical filter are curved so that respective centers thereof are deflexed in a direction away from said lens by a stress resulting from the difference between the thermal expansion coefficient of said substrate and respective thermal expansion coefficients of said semiconductor imaging element and said optical filter.