Side view light emitting diode package
AssigneeAlti-Electronics Co., Ltd.
InventorsKyoung-Il Park, Jin-Won Lee, Sun-Hong Kim, Min-Sik Kim, Ji-Na Lee
Life of this patent
Estimating the term…
Loading patent…
AssigneeAlti-Electronics Co., Ltd.
InventorsKyoung-Il Park, Jin-Won Lee, Sun-Hong Kim, Min-Sik Kim, Ji-Na Lee
Estimating the term…
Provided is a side view light emitting diode package including a housing that includes a front side part and a rear side part integrally formed with the front side part, the front side part having a light emission part; and a lead frame that is located between the front side part and the rear side part, wherein the lead frame includes a first lead connected to a first electrode of a Light Emitting Diode (LED) chip and a second lead connected to a second electrode of the LED chip, wherein the front side part includes a first groove, a second groove, and a third groove, wherein the first lead and the second lead are extended through the first groove and the second groove, respectively, and a heat dissipation part is extended from the first lead through the third groove to an outside of the LED package.
A side view Light Emitting Diode (LED) package comprising:
Dependencies are inferred from the claim text.