Chip coated light emitting diode package and manufacturing method thereof

An illumination device comprising:

• a package body having an electrode part;
• and
• a light emitting chip mounted on the package body including:
• a submount,
• a light emitting diode (LED) chip die attached to the submount;
• a resin layer covering an upper surface of the LED chip die;
• and
• at least one bump ball provided on the LED chip die and exposed through an upper surface of the resin layer,
• wherein the LED chip die has at least one first electrode disposed on the upper surface thereof and a second electrode disposed on a lower surface thereof,
• wherein an entire portion of the resin layer under which the LED chip die is disposed has a substantially uniform vertical thickness, and
• wherein the at least one bump ball are connected to the first electrode and the electrode part is electrically connected to the at least one bump ball,
• wherein the package body has a disposition hole formed therein, the disposition hole exposing a metallic chassis with the light emitting chip mounted thereon, and the package body comprises a substrate having the electrode part that is pattern printed on an upper surface of the substrate.

An illumination device comprising:

• a package body having an electrode part;
• and
• a light emitting chip mounted on the package body including:
• a submount;
• a light emitting diode (LED) chip die attached to the submount;
• a resin layer covering an upper surface of the chip die;
• and
• at least one bump ball provided on the chip die and exposed through an upper surface of the resin layer, the bump ball having an upper surface substantially coplanar with an upper surface of the resin layer,
• wherein the resin layer directly contacts a portion of the upper surface of the chip die other than an area of the upper surface of the chip die on which the bump ball is disposed,
• wherein the electrode part is electrically connected to the at least one bump ball.

An illumination device comprising:

• a package body having an electrode part;
• and
• a light emitting chip mounted on the package body including:
• a submount;
• a light emitting diode (LED) chip die attached to the submount;
• a resin layer covering an upper surface of the chip die;
• and
• at least one bump ball provided on the chip die and exposed through an upper surface of the resin layer, the bump ball having an upper surface substantially coplanar with an upper surface of the resin layer,
• wherein an entire portion of the resin layer under which the LED chip die is disposed has a substantially uniform vertical thickness,
• wherein the electrode part is electrically connected to the at least one bump ball.