Portable memory devices
AssigneeSanDisk Technologies LLC
InventorsWarren Middlekauff, Robert Miller, Charlie Centofante
Life of this patent
Estimating the term…
Abstract
Improved techniques to produce integrated circuit products are disclosed. The improved techniques permit smaller and less costly production of integrated circuit products. One aspect of the invention concerns covering test contacts (e.g., test pins) provided with the integrated circuit products using printed ink. Once covered with the ink, the test contacts are no longer electrically exposed. Hence, the integrated circuit products are not susceptible to accidental access or electrostatic discharge. Moreover, the integrated circuit products can be efficiently produced in a small form factor without any need for additional packaging or labels to electrically isolate the test contacts.
Claims26
A memory card, comprising:
- a circuit board having a front side and a back side, the front side including at least one die attach pad, and the back side including I/O contacts and test contacts;
- at least one semiconductor die attached to the front side of said circuit board, said at least one semiconductor die being electrically connected to the die attach pad of said circuit board;
- a molding compound to encapsulate said at least one semiconductor die and the front side of said circuit board;
- and
- an ink coating concentrated over individual test contacts on the back side of said circuit board but not over the I/O contacts on the back side of said circuit board.
An electronic system, comprising:
- a data acquisition device;
- and
- a data storage device removably coupled to said data acquisition device, said data storage device storing data acquired by said data acquisition device, and said data storage device including at least:
- a circuit board having a first side and a second side, the first side including die attach pads, and the second side including I/O contacts and test contacts;
- at least one semiconductor die attached to the first side of said circuit board, said at least one semiconductor die being electrically connected to the die attach pads of said circuit board;
- a molding compound to encapsulate said at least one semiconductor die and the first side of said circuit board;
- and
- an ink coating concentrated over individual test contacts on the second side of said circuit board but not over the I/O contacts on the second side of said circuit board.
An integrated circuit product, comprising:
- a circuit board having a front side and a back side, the front side including die attach pads, and the back side including I/O contacts and test contacts;
- at least one semiconductor die attached to the front side of said circuit board, said at least one semiconductor die being electrically connected to the die attach pads of said circuit board;
- a molding compound to encapsulate said at least one semiconductor die and the front side of said circuit board;
- and
- an ink coating concentrated over individual test contacts on the back side of said circuit board but not over the I/O contacts on the back side of said circuit board,
- wherein a substantial portion of the back side is exposed without the ink coating.
Dependencies are inferred from the claim text.