Soldering method and apparatus
AssigneeSAE Magnetics (H.K.) Ltd.
InventorsHiroshi Fukaya, Satoshi Yamaguchi
Life of this patent
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Abstract
To improve the quality of the products that are manufactured by soldering, through enabling highly reliable soldering while suppressing damages to the bonding targets caused due to the soldering. Provided is a soldering method for bonding each of bonding pads formed in respective bonding targets with solder. The method comprises: a bonding target placing step for placing each of bonding targets to a bonding position; a soldering step for placing solder between each of the bonding pads formed in each of the bonding targets, and for performing soldering by irradiating a heating beam to the solder; and a bonding target heating step for heating at least one of the bonding targets, which is executed before the soldering step and/or simultaneously with the soldering step.
Claims13
A soldering method, comprising:
- providing a plurality of bonding targets and placing each of the plurality of bonding targets at a corresponding bonding position;
- each of the plurality of bonding targets being provided with corresponding bonding pads, and placing solder between each of the corresponding bonding pads and soldering by irradiating a heating beam to the solder;
- and
- heating at least one of the bonding targets before and/or simultaneously with the soldering,
- the placing of the bonding target comprising providing a transporter that holds the bonding target and transports the bonding target to the corresponding bonding position, and
- the heating of the bonding target comprising providing a bonding target heater that heats the bonding target, by heating the transporter, while the bonding target is transported.
A soldering apparatus, comprising:
- a bonding target placing device that places each of a plurality of bonding targets at a corresponding bonding position;
- a soldering heating device that performs soldering by irradiating a heating beam to solder that is placed between corresponding bonding pads formed in each of the plurality of bonding targets;
- a bonding target heating device that heats at least one of the bonding targets, the bonding target heating device being different from the solder heating device;
- the bonding target placing device comprising the transporter that holds the bonding target and transports the bonding target to the corresponding bonding position, and
- the bonding target heating device heating the bonding target by heating the transporter before the solder heating device irradiates the heating beam to the solder and/or while the solder heating device is irradiating the heat beam to the solder.
Dependencies are inferred from the claim text.