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US 8,013,256 B2Granted
Printed wiring board
AssigneeIbiden Co., Ltd.
InventorToru Nakai
Life of this patent
Estimating the term…
Abstract
A printed wiring board including solder pads excellent in frequency characteristic is provided. To do so, each solder pad 73 is formed by providing a single tin layer 74 on a conductor circuit 158 or a via 160. Therefore, a signal propagation rate can be increased, as compared with a printed wiring board of the prior art on which two metal layers are formed. In addition, due to lack of nickel layers, manufacturing cost can be decreased and electric characteristics can be enhanced.
Claims15
A printed wiring board comprising:
- a circuit board;
- an organic resin insulating layer disposed on the circuit board and having a first opening;
- a via conductor formed in the first opening in the organic resin insulating layer;
- a solder resist layer disposed on the organic resin insulating layer and having a second opening to expose a surface of the via conductor;
- and
- a single metal layer provided on the surface of the via conductor,
- wherein
- the surface of the via conductor electrically contacts a BGA (ball grid array) through the single metal layer between the via conductor and the BGA, and
- the single metal layer includes only one noble metal or includes only tin.
6 more elements
A printed wiring board comprising:
- a circuit board;
- an organic resin insulating layer disposed on the circuit board;
- a solder resist layer disposed on the organic resin insulating layer;
- and
- a single metal layer including only one noble metal or including only tin provided on a conductor circuit on the organic resin insulating layer,
- wherein
- the single metal layer contacts a sidewall of the solder resist layer, and
- the single metal layer electrically contacts a BGA (ball grid array).
5 more elements
Dependencies are inferred from the claim text.