Printed circuit board
AssigneeGigalane Co., Ltd.
InventorsYong Goo Lee, Kyoung il Kang
Life of this patent
Estimating the term…
Abstract
The present disclosure provides a printed circuit board (PCB) comprising a first ground layer extended in one direction a first dielectric layer laminated on the first ground layer and extended in the same direction as that of the first ground layer; a signal transmission line laminated on the first dielectric layer and extended in the same direction as that of the first dielectric layer; and a plurality of first ground patterns formed by etching a surface of the first ground layer in an axial direction thereof at a predetermined interval in a line, wherein the plurality of first ground patterns expose the first dielectric layer.
Claims11
A PCB comprising:
- a first ground layer extended in one direction;
- a first dielectric layer laminated one the first ground layer and extended in the same direction as that of the first ground layer;
- a signal transmission line laminated on the first dielectric layer and extended in the same direction as that of the first dielectric layer;
- a first ground pattern formed by etching a surface of the first ground layer in an axial direction thereof with a predetermined width;
- and
- a plurality of second ground patterns formed by etching the surface of the first ground layer at both sides of the first ground pattern in the axial direction at a predetermined interval in a line,
- wherein a part of each of the plurality of second ground patterns, far from the first ground pattern, has a greater width than that of another part thereof, close to the first ground pattern, and
- wherein the first ground pattern and the plurality of second ground patterns expose the first dielectric layer.
A PCB comprising:
- a first ground layer extended in one direction;
- a first dielectric layer laminated on the first ground layer and extended in an axial direction of the first ground layer;
- a signal transmission line laminated on the first dielectric layer and extended in an axial direction of the first dielectric layer;
- a plurality of first ground patterns formed by etching a surface of the first ground layer in an axial direction thereof at a predetermined interval in a line;
- and
- a plurality of second ground patterns formed by etching the surface of the first ground layer at both sides of the plurality of first ground patterns at a predetermined interval in a line,
- wherein, when further from a center of the first ground layer, the width of each of the plurality of second ground patterns increases, which is measured in the axial direction of the first ground layer, and
- the plurality of first and second ground patterns expose the first dielectric layer.
Dependencies are inferred from the claim text.