White heat-curable silicone resin composition, optoelectronic part case, and molding method
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsYusuke Taguchi, Kazutoshi Tomiyoshi, Tomoyoshi Tada, Hisashi Shimizu
Life of this patent
Estimating the term…
Abstract
A silicone resin composition comprising (A) a heat-curable organopolysiloxane having a melting point of 40-130° C., (B) a white pigment, (C) an inorganic filler, and (D) a curing catalyst is transfer or compression moldable at elevated temperatures into a cured product having white color, heat resistance, light resistance and minimal yellowing. The cured product is suited as a case in which an optoelectronic part is enclosed.
Claims7
A white heat-curable silicone resin composition for forming optoelectronic part cases, comprising
- (A) a heat-curable organopolysiloxane having a melting point of 40 to 130°,
- (B) titanium dioxide in an amount of 5 to 50% by weight based on the total weight of the composition,
- (C) a silica in an amount of 200 to 900 parts by weight per 100 parts by weight of component (A), and
- (D) a curing catalyst.
An optoelectronic part case comprising a silicone resin composition in the cured state, said composition comprising
- (A) a heat-curable organopolysiloxane having a melting point of 40 to 130°,
- (B) titanium dioxide in an amount of 5 to 50% by weight based on the total weight of the composition,
- (C) a silica in an amount of 200 to 900 parts by weight per 100 parts by weight of component (A), and
- (D) a curing catalyst,
- in which cured composition a transparent resin-encapsulated optoelectronic part is enclosed.
An optoelectronic part case comprising a silicone resin composition in the cured state, said composition comprising
- (A) a heat-curable organopolysiloxane having a melting point of 40 to 130°,
- (B) a white pigment selected from the group consisting of titanium dioxide, potassium titanate, zirconium oxide, zinc sulfide, zinc oxide, and magnesium oxide,
- (D) a curing catalyst,
- (E) a whisker of an inorganic material selected from the group consisting of amorphous fibers, polycrystalline fibers, single crystal fibers, and metal fibers, and
- (C) an inorganic filler, other than said pigment (B) and other than said whisker (E),
- in which cured composition a transparent resin-encapsulated optoelectronic part is enclosed.
Dependencies are inferred from the claim text.