Curable resin, production method thereof, epoxy resin composition, and electronic device
AssigneeHitachi Chemical Company, Ltd.
InventorsShinya Nakamura, Tomoya Masuda, Mitsuo Katayose
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AssigneeHitachi Chemical Company, Ltd.
InventorsShinya Nakamura, Tomoya Masuda, Mitsuo Katayose
Estimating the term…
A curable resin which exhibits excellent heat resistance while including an extremely smaller amount of volatile component is disclosed, and an electronic component device having excellent reliability in heat resistance and the like which contains the above curable resin is provided. A curable resin obtained in reaction of at least one compound (a) selected from the group consisting of the silane compounds represented by the following Formula (I-1) and the partial condensates thereof with a phenol compound (b), comprising a remaining volatile component in an amount of 10 wt % or less with respect to the total weight of the curable resin is used as a curing agent. [Formula 1] R1nSiR2(4-n) (I-1) (Wherein, n denotes a number of 0 to 2; R1 represent a hydrogen atom, or substituted or unsubstituted hydrocarbon groups having 1 to 18 carbon atoms; R2 represent a halogen atom, a hydroxyl group, substituted or unsubstituted oxy groups, amino groups, and carbonyloxy groups having 1 to 18 carbon atoms; and two or more of R1 and R2 may bind to each other to form a cyclic structure).
A method of producing a curable resin, comprising a step of:
A method of producing a curable resin, comprising a step of
An epoxy resin composition, comprising an epoxy resin (A) and a curing agent (B), wherein the curing agent (B) includes a curable resin obtained in reaction of at least one compound (a) selected from the group consisting of the silane compounds represented by the following Formula (I-1) and the partial condensates thereof with phenol compounds (b),
An epoxy resin composition, comprising an epoxy resin (A) and a curing agent (B), wherein the curing agent (B) includes a curable resin having an aryloxysilyl (ArO—Si) bond, the curable resin comprising at least one structural unit selected from the group consisting of the structural units represented by the following Formulas (I-2a), (I-3a), (I-2b), and (I-3b):
A method of producing a curable resin, comprising a step of
An epoxy resin composition, comprising an epoxy resin (A) and a curing agent (B), wherein the curing agent (B) includes a curable resin, the curable resin comprising at least one of a compound having the structural unit represented by the following Formula (I-4a) and a compound having the structural unit represented by the following Formula (I-4b):
A method of producing a curable resin, comprising a step of
Dependencies are inferred from the claim text.