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US 8,012,869 B2Granted
Bonded structure and bonding method
AssigneePanasonic Corporation
InventorsMasanori Minamio, Hiroaki Fujimoto, Atsuhito Mizutani, Hisaki Fujitani, Toshiyuki Fukuda
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Abstract
An aluminum wire is bonded to a silicon electrode by a wedge tool pressing the aluminum wire against the silicon electrode. In this way, a firmly bonded structure is obtained by sequentially stacking aluminum, aluminum oxide, silicon oxide, and silicon.
Claims8
A method for bonding an aluminum bonding member and a silicon electrode, said method comprising the steps of:
- providing the aluminum bonding member and the silicon electrode;
- and
- bonding the aluminum bonding member and the silicon electrode by pressing the aluminum bonding member against the silicon electrode and applying ultrasound to the aluminum bonding member,
- wherein in the bonding step, at an interface at which the aluminum bonding member and the silicon electrode are bonded to each other, a layer of aluminum oxide and a layer of silicon oxide are formed between the aluminum bonding member and the silicon electrode,
- the aluminum bonding member, the layer of aluminum oxide, the layer of silicon oxide, and the silicon electrode are sequentially stacked,
- the aluminum bonding member comes into direct contact with the layer of aluminum oxide, while the silicon electrode comes into direct contact with the layer of silicon oxide, and
- the layer of aluminum oxide comes into direct contact with the layer of silicon oxide.
4 more elements
Dependencies are inferred from the claim text.