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US 8,012,866 B2Granted
Method of bonding semiconductor devices utilizing solder balls
AssigneeASM Assembly Automation Ltd.
InventorsPing Liang Tu, Chun Hung Samuel Ip
Life of this patent
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Abstract
A method for bonding a semiconductor device onto a substrate is provided which comprises the steps of picking up a solder ball with a pick head, placing the solder ball onto the substrate and melting the solder ball on the substrate and placing the semiconductor device on the molten solder ball. The molten solder ball is then allowed to cool to form a solder joint which bonds the semiconductor device to the substrate.
Claims19
Method for bonding a semiconductor device onto a substrate, comprising the steps of:
- picking up a solder ball with a pick head;
- placing the solder ball onto the substrate;
- melting the solder ball on the substrate;
- placing the semiconductor device on the molten solder ball;
- and thereafter
- cooling the molten solder ball to form a solder joint to bond the semiconductor device to the substrate;
- and
- heating the substrate to a predetermined temperature which is higher than a melting point of the solder ball before the step of placing the solder ball onto the substrate.
5 more elements
Method for bonding a high-power LED chip onto a substrate, comprising the steps of:
- picking up a solder ball with a pick head;
- placing the solder ball onto the substrate;
- melting the solder ball on the substrate;
- placing the high-power LED chip on the molten solder ball;
- and thereafter
- cooling the molten solder ball to form a solder joint to bond the high-power LED chip to the substrate;
- and
- heating the substrate to a predetermined temperature which is higher than a melting point of the solder ball before the step of placing the solder ball onto the substrate.
5 more elements
Dependencies are inferred from the claim text.