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US 8,012,815 B2Granted
Array substrate and method for fabricating thereof
AssigneeAu Optronics Corporation
InventorsChih-Hung Shih, Ming-Yuan Huang, Chih-Chun Yang
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Abstract
The invention provides a method for manufacturing an array substrate utilizing a laser ablation process. A conductive layer can be selectively patterned by the laser ablation process without a photo mask due to different adhesions between the conductive layer and other materials. The patterned conductive layer thus formed adjoins an inorganic passivation layer to provide a substantially continuous surface.
Claims16
A method for manufacturing an array substrate, comprising:
- forming a contact pad, a thin film transistor (TFT), a pixel region, and a storage capacitor on a substrate;
- forming an organic material layer on the contact pad, the TFT, the pixel region, and the storage capacitor;
- patterning the organic material layer to expose the pixel region, part of the contact pad, part of the TFT, and part of the storage capacitor;
- depositing a conductive layer on the exposed pixel region, exposed the part of the contact pad, exposed the part of the TFT, and exposed the part of the storage capacitor;
- and
- performing a laser ablation process to remove the conductive layer on the organic material layer and remain the conductive layer on the pixel region, on the part of the contact pad, on the part of the TFT, and on the part of the storage capacitor.
3 more elements
Dependencies are inferred from the claim text.